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Creonic, the leading provider of high-performance IP cores for ASIC and FPGA technologies, has unveiled a bold new brand identity, reaffirming its commitment ... Read

VeriSilicon Launches Ultra-Low Power OpenGL ES GPU with Hybrid 3D/2.5D Rendering for Wearables ...
VeriSilicon’s GCNano3DVG IP combines optimized hardware pipelines with a lightweight and configurable software stack to deliver efficient, low-power ... Read

The transaction will augment Cadence’s expanding design IP offerings, anchored by a leading portfolio of protocol and interface IP, memory interface ... Read

Vertex Growth is a growth-stage venture capital fund anchored by Vertex Holdings, a subsidiary of global investment firm Temasek. The fund is dedicated ... Read

Together with aconnic AG, Fraunhofer IPMS has developed an innovative IP core as part of the “RealSec5G” project, which combines the advantages of ... Read

Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and ...
The ODT-PVT-ULP-001C-3 provides simple and seamless integration, requiring just a single core-voltage supply and a digital interface, removing the need ... Read
Industry Expert Blogs

Eric Esteve

Markus Willems, Synopsys

Ronny Vatelmacher, Ceva

Reela S., Cadence
Industry Articles
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Beyond Limits: Unleashing the 10.7 Gbps LPDDR5X Subsystem
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How to Design Secure SoCs: Essential Security Features for Digital Designers
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System level on-chip monitoring and analytics with Tessent Embedded Analytics
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What tamper detection IP brings to SoC designs
Chris Morrison,
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RISC-V in 2025: Progress, Challenges,and What's Next for Automotive & OpenHardware
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ChipFlow -
Understanding MACsec and Its Integration
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Discover new Tessent UltraSight-V from Siemens EDA, and accelerate your RISC-V development.
Francisca Tan
Tessent Embedded Analytics -
The Critical Factors of a High-performance Audio Codec - What Chip Designers Need to Know
Innosilicon