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Industry Expert Blogs
The Future is the Interconnect: IITCMonolithIC 3D Blog - Ze'ev Wurman, Chief Software Architect, MonolithIC 3D Inc.May. 21, 2012 |
The next International Interconnect Technology Conference (IITC 2012) will be held in San Jose in a couple of weeks (June 4-6). This is a good opportunity to recall that, in some sense, the reason for scaling silicon down has changed in recent years from packing more transistors in a square (or cubic) millimeter to increasing functionality and performance at reduced power. An ever higher fraction of the power dissipation resides in the interconnect – both in the net switching itself as well as in the ever-increasing number of repeaters required to re-power more and more “long” nets.