English
Original Lossless codec IP core - Full HD 30fps@126MHz (1Sample/clk)
Ultrawideband SoCs pose new challenges to manufacturers
Anthony Lum, SoC Product Engineer, AdvantestAmerica
(10/15/2007 11:54 AM EDT) -- EE Times
What do these three killer wireless applications have in common: Viewing HDTV on a mobile device using 4G WiMax technologies; using existing WLAN infrastructure to make phone calls; and using ultrawideband (UWB) technology to download or print pictures from a digital camera?
Answer: All use a complex digital modulation scheme to transfer data over the airwaves, all are a variant of orthogonal frequency division multiplexing (OFDM) and all will become standard capabilities in the next 18 to 24 months as consumer-driven demand for wireless applications hastens convergence of mobile audio, video and data.
As advanced UWB wireless applications and ICs evolve, test technology must also evolve. ATE manufacturers need to prepare today to address test challenges on the horizon: high-end frequency coverage, broad frequency band range, high modulation bandwidth, low power levels, frequency agility and complex modulation analysis.
(10/15/2007 11:54 AM EDT) -- EE Times
What do these three killer wireless applications have in common: Viewing HDTV on a mobile device using 4G WiMax technologies; using existing WLAN infrastructure to make phone calls; and using ultrawideband (UWB) technology to download or print pictures from a digital camera?
Answer: All use a complex digital modulation scheme to transfer data over the airwaves, all are a variant of orthogonal frequency division multiplexing (OFDM) and all will become standard capabilities in the next 18 to 24 months as consumer-driven demand for wireless applications hastens convergence of mobile audio, video and data.
As advanced UWB wireless applications and ICs evolve, test technology must also evolve. ATE manufacturers need to prepare today to address test challenges on the horizon: high-end frequency coverage, broad frequency band range, high modulation bandwidth, low power levels, frequency agility and complex modulation analysis.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related Articles
- Opportunities and Challenges for Near-Threshold Technology in End-Point SoCs for the Internet of Things
- Challenges in verifying PCI Express in complex SoCs
- USB 3.1 Links Pose Challenges
- Challenges in LBIST validation for high reliability SoCs
- FPGA prototyping of complex SoCs: Partitioning and Timing Closure Challenges with Solutions
New Articles
- Discover new Tessent UltraSight-V from Siemens EDA, and accelerate your RISC-V development.
- The Critical Factors of a High-performance Audio Codec - What Chip Designers Need to Know
- Density Management in Analog Layout Design: Addressing Issues and Ensuring Consistency
- Nexus: A Lightweight and Scalable Multi-Agent Framework for Complex Tasks Automation
- How the Ability to Manage Register Specifications Helps You Create More Competitive Products
Most Popular
- System Verilog Assertions Simplified
- System Verilog Macro: A Powerful Feature for Design Verification Projects
- Synthesis Methodology & Netlist Qualification
- Discover new Tessent UltraSight-V from Siemens EDA, and accelerate your RISC-V development.
- Understanding Logic Equivalence Check (LEC) Flow and Its Challenges and Proposed Solution