M-LVDS for true multipoint interfaces on busses--and more
Planet Analog (Mar 30, 2009)
Over the years, various technologies have been used to transmit signals over backplane busses. As speeds increase to cater to the ever-growing volume of telecom and datacom traffic, the limitation of the older, single-ended and emitter-coupled logic techniques becomes apparent.
Multipoint, low-voltage differential signaling (M-LVDS) is an interface standard similar to LVDS. It provides the benefits of high-speed, low-power, and low-EMI transmission solutions to today's bus applications. M-LVDS is suitable for data, control, synchronization and clock signals.
In today's backplanes, high-speed signals carrying the payload data are typically point-to-point (one driver and one receiver) interfaces. These connect various core chips such as ASICs, FPGAs, DSPs, and similar. Properly terminated point-to-point interfaces offer the best performance for high-speed signals. Signaling levels used can be PECL, CML, VML and LVDS with speeds going up to 4Gbps and higher, Figure 1.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related Articles
- Integration of power:communication interfaces in smart true wireless headset designs
- What is JESD204B? Quick summary of the standard
- What is JESD204C? A quick glance at the standard
- Why Interlaken is a great choice for architecting chip to chip communications in AI chips
- Automotive electronics revolution requires faster, smarter interfaces
New Articles
- Beyond Limits: Unleashing the 10.7 Gbps LPDDR5X Subsystem
- How to Design Secure SoCs: Essential Security Features for Digital Designers
- System level on-chip monitoring and analytics with Tessent Embedded Analytics
- What tamper detection IP brings to SoC designs
- RISC-V in 2025: Progress, Challenges,and What's Next for Automotive & OpenHardware