e-MMC vs. NAND with built-in ECC
Doug Wong, Toshiba America Electronic Components, Inc.
8/18/2011 9:44 AM EDT
As NAND flash continues to increase in density and decrease in cost per gigabyte, it has enabled more cost-effective storage. This benefits a wide (and constantly growing) range of digital consumer products. Selecting the most appropriate high performance NAND architecture for any given application is of increasing importance as the ECC requirements for NAND continue to increase.
This article will explore the attributes of and differences between e-MMC and NAND with built-in ECC (such as Toshiba’s SmartNANDTM) – as well as go into detail about the applications that are best suited for each.
E-mail This Article | Printer-Friendly Page |
|
Related Articles
- Picking the right built-in self-test strategy for your embedded ASIC
- Built-In DMA Engines Unleash Power of PCI Express Switches
- A comparison of SRAM vs quantum-derived semiconductor PUFs
- PCIe 5.0 vs. Emerging Protocol Standards - Will PCIe 5.0 Become Ubiquitous in Tomorrow's SoCs?
- Transactor vs CPU in SoC Verification
New Articles
- Accelerating RISC-V development with Tessent UltraSight-V
- Automotive Ethernet Security Using MACsec
- What is JESD204C? A quick glance at the standard
- Optimizing Power Efficiency in SOC with PVT Sensor-Assisted DVFS Technology
- Bandgap Reference (BGR) Circuit Design and Transient Analysis in 90nm VLSI Technology
Most Popular
- Accelerating RISC-V development with Tessent UltraSight-V
- System Verilog Assertions Simplified
- Synthesis Methodology & Netlist Qualification
- System Verilog Macro: A Powerful Feature for Design Verification Projects
- Enhancing VLSI Design Efficiency: Tackling Congestion and Shorts with Practical Approaches and PnR Tool (ICC2)