Software Defined Radio with Spread spectrum and SOQPSK for Telemetry applications
2D vs. 2.5D vs. 3D ICs 101
Clive Maxfield, EETimes
4/8/2012 12:08 PM EDT
I see a lot of articles bouncing around the Internet these days about 2.5D and 3D ICs. One really good one that came out recently was 2.5D ICs are more than a stepping stone to 3D ICs by Mike Santarini of Xilinx. On the other hand, there are a lot of other articles that have “3D ICs” in the title, but when I plunge in I realize that we’re really only talking about 2.5D ICs.
The problem is that there’s a lot of confusion in this area. While chatting to people I find that they typically either know this stuff “inside and out” … or they are somewhat baffled and bewildered. Thus, I decided to pen a few words on the subject to explain the way in which I see things. The following is “off the top of my head”, so please feel free to comment saying whether you agree or disagree with my meandering musings.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related Articles
New Articles
- System level on-chip monitoring and analytics with Tessent Embedded Analytics
- What tamper detection IP brings to SoC designs
- RISC-V in 2025: Progress, Challenges,and What's Next for Automotive & OpenHardware
- Understanding MACsec and Its Integration
- Discover new Tessent UltraSight-V from Siemens EDA, and accelerate your RISC-V development.