English
Die bonding techniques and methods
Gurinder Singh Baghria, Naveen Kumar, Deepak Sharma, Sachin Kalra (Freescale Semiconductors)
EETimes (7/9/2012 12:15 PM EDT)
Die Bonding is the process of attaching the semiconductor die either to its package or to some substrate. The process starts with picking the target die from wafer or waffle tray. The most common method is to push the target die from the tape with a pin. The tape can also be drawn away from the die by vacuum. The released die is generally picked by a vacuum tool and aligned to a target pad on the carrier or substrate, and then permanently attached, using one of several die bonding techniques.
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