English
Bluetooth low energy v6.0 Baseband Controller, Protocol Software Stack and Profiles IP
The Challenges of USB 3.0
Terrill Moore, MCCI Corporation
EDN (October 1, 2012)
After a three-year teething period, USB 3.0 is finally mainstream. Microsoft and Apple support USB 3.0 in their latest releases of Windows and Mac OS X, respectively; Intel and AMD support USB 3.0 in their latest chipsets. This creates critical mass, which will cause USB 3.0 peripheral deployment to ramp significantly in the coming year. This will fuel a new round of USB 3.0 adoption in embedded systems. This article explores the likely issues that developers will encounter when bringing up USB 3.0 devices.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related Articles
- Overcome signal attenuation, noise and jitter interference challenges in USB 3.0 system design
- Improving USB 3.0 with better I/O management
- Design optimization of flip-chip packages integrating USB 3.0
- USB 3.0: Delivering superspeed with 25% lower power
- SuperSpeed USB (USB 3.0): More than just a speed increase
New Articles
- Accelerating RISC-V development with Tessent UltraSight-V
- Automotive Ethernet Security Using MACsec
- What is JESD204C? A quick glance at the standard
- Optimizing Power Efficiency in SOC with PVT Sensor-Assisted DVFS Technology
- Bandgap Reference (BGR) Circuit Design and Transient Analysis in 90nm VLSI Technology
Most Popular
- Accelerating RISC-V development with Tessent UltraSight-V
- System Verilog Assertions Simplified
- Synthesis Methodology & Netlist Qualification
- System Verilog Macro: A Powerful Feature for Design Verification Projects
- Enhancing VLSI Design Efficiency: Tackling Congestion and Shorts with Practical Approaches and PnR Tool (ICC2)