English
The Challenges of USB 3.0
Terrill Moore, MCCI Corporation
EDN (October 1, 2012)
After a three-year teething period, USB 3.0 is finally mainstream. Microsoft and Apple support USB 3.0 in their latest releases of Windows and Mac OS X, respectively; Intel and AMD support USB 3.0 in their latest chipsets. This creates critical mass, which will cause USB 3.0 peripheral deployment to ramp significantly in the coming year. This will fuel a new round of USB 3.0 adoption in embedded systems. This article explores the likely issues that developers will encounter when bringing up USB 3.0 devices.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related Articles
- Overcome signal attenuation, noise and jitter interference challenges in USB 3.0 system design
- Improving USB 3.0 with better I/O management
- Design optimization of flip-chip packages integrating USB 3.0
- USB 3.0: Delivering superspeed with 25% lower power
- SuperSpeed USB (USB 3.0): More than just a speed increase