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D&R Industry Articles (June 2011)
Articles for the Week of June 27, 2011
Additional Articles- Managing power in embedded applications using dual operating systems
- Medical imaging process accelerated in FPGA 82X faster than software
- IP Re-Engineering and Design Methodology
- Securing Highly Sensitive Assets with AuthenTec's SafeZone Secure Platform
Articles for the Week of June 20, 2011
Featured Article
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Breaking the Language Barriers: Using Coverage Driven Verification to Improve the Quality of IP
This paper presents two unique solutions for facilitating functional coverage in VHDL and SystemC. One approach is to use post-simulation Value Change Dump (VCD) files to calculate functional coverage. The other approach, which is applicable only to SystemC, proposes extending the SystemC Verification Library (SCV) to facilitate functional coverage calculation.- Down & dirty with HW/SW co-design: Part 4 – Multi-objective optimization
- Down & dirty with HW/SW co-design: Part 3 - Cosynthesis of multiprocessors
- Viewpoint: EDA vendors must focus on making silicon profitable for their customers
- Application Driven Network on Chip Architecture Exploration & Refinement for a Complex SoC
- Zynq-7000 EPP sets stage for new era of innovations
Articles for the Week of June 13, 2011
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Android, Linux and Real-Time Development for Embedded Systems
Android is an open source platform built by Google that includes an operating system, middleware and applications for the development of devices employing cellular communications. This session takes a look at the design of Android, how it works and how it may be deployed to accelerate the development of a connected device. Along with guidelines to getting started with Android, the Android SDK, its available tools and resources will be reviewed and consideration given to applications for Android beyond conventional mobile handsets such as medical devices, consumer electronics and military/aerospace systems. A brief review of how Android or Linux can coexist with an RTOS in multi-core designs will also be conducted.- Moore's Law, the bifurcation of the semiconductor industry and 3-D integration
- Basics of SoC I/O design: Part 1 - The building blocks
- Basics of SoC I/O design: Part 2 - Hot swap & other implementation issues
- Understanding SD, SDIO and MMC Interface
- What's new in the Semiconductor IP market? The case of civilian Aerospace industry
- Silicon Qualified SuperViC: the only way to safe SoC integration
- Managing intelligent I/O processing on DSP + GPP SoCs
- Improving USB 3.0 with better I/O management
- Software and hardware challenges due to the dynamic raw NAND market
Articles for the Week of June 6, 2011
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Additional Articles
A Case for Custom Power Management ASIC
As more functionality has been added to the devices, the power requirements have increased. As the power requirement grows, the capacity of the battery has to be increased, increasing the space occupied and its weight. This makes the battery one of the bulkiest component in the handhelds.- 3-D IC design: New possibilities for the wireless market
- The Sony PlayStation 3 hack deciphered: what consumer-electronics designers can learn from the failure to protect a billion-dollar product ecosystem
- Improving today's multimedia products with 3rd-party audio IP solutions
Articles for the Week of May 30, 2011
Additional Articles- HW/SW co-verification basics: Part 3 - Hardware-centric methods
- HW/SW co-verification basics: Part 2 - Software-centric methods
- Two methodologies for ASIC conversion