D&R Industry Articles (November 2023)
Articles for the Week of November 27, 2023
Reliability challenges in 3D IC semiconductor design
3D ICs represent an expansion of heterogeneous advanced package technology into the third dimension, presenting similar design to manufacturability challenges as 2D advanced packages along with additional complexities.- Optimizing embedded software for real-time multimedia processing
- Optimizing Electronics Design With AI Co-Pilots
- Revolutionizing High-Voltage Controller Chips for Electric Vehicles
Articles for the Week of November 20, 2023
Hardware-Assisted Verification: Ideal Foundation for RISC-V Adoption
HAV is becoming an enabler for the emerging ecosystem based on its ability to run many cycles of software-driven validation.Articles for the Week of November 13, 2023
Menta eFPGA IP for Edge AI
The paper is divided into two main sections: the first one deals with AI algorithms, with a particular focus on Artificial Neural Networks (ANNs), which are widely acknowledged as the most commonly employed techniques in the field. The second part of the paper shifts its focus to their hardware implementation, where three distinct hardware categories are evaluated: general-purpose processors, specialized AI chips, and programmable systems.Articles for the Week of November 6, 2023
Inside HDR10: A technical exploration of High Dynamic Range
High Dynamic Range (HDR) technology has taken the world of visual entertainment, especially streaming media solutions, by storm. It's the secret sauce that makes images and videos look incredibly lifelike and captivating. From the vibrant colors in your favourite movies to the dazzling graphics in video games, HDR has revolutionized how we perceive visuals on screens.Articles for the Week of October 30, 2023
Additional Articles- Parsing the Mindboggling Cost of Ownership of Generative AI
- Adopting IEC 62443 standards for infrastructure cybersecurity