D&R Industry Articles (August 2024)

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How to cost-efficiently add Ethernet switching to industrial devices

This post explores critical considerations and solutions for implementing Ethernet switches tailored to industrial applications, emphasizing required features and cost-effectiveness.

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Why Interlaken is a great choice for architecting chip to chip communications in AI chips

The Interlaken protocol is an advanced interconnect technology that effectively addresses the architecture and design requirements of AI chips. It provides high bandwidth through multi-gigabit-per-second lanes, facilitating the handling of large data volumes and sustaining high computational throughput.

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Key considerations and challenges when choosing LDOs

The vast array of on-chip LDO options and characteristics can make the selection process complex.

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BCD Technology: A Unified Approach to Analog, Digital, and Power Design

Since its inception, BCD technology has leveraged the integration of two primary technologies—polysilicon gate CMOS and DMOS power architecture—on the same chip. Its compatibility with bipolar components has enabled the creation of SoCs (System-on-Chip) that combine digital and analog control with efficient power management sections.