1.8V/3.3V I2C 5V Failsafe Failtolerant Automotive Grade 1 in GF (12nm)
Industry Expert Blogs
The Riddle Of 450mmMannerisms - David MannersMay. 10, 2010 |
The whole 450mm wafer thing is a puzzle. Last week at IEF 2010, there was TSMC's CTO Jack Sun, saying he wanted and expected 450mm to happen while, listening to him in the audience, was Heinz Kundert, European CEO of SEMI whose members make the chip manufacturing equipment, who said later: "We don't want it."