MIPI C-PHY v1.2 D-PHY v2.1 TX 3 trios/4 Lanes in TSMC (16nm, 12nm, N7, N6, N5, N3E)
Industry Expert Blogs
TSMC versus GlobalFoundries: Semiconductor Design Enablement!Silicon Valley Blog - Daniel NenniAug. 09, 2010 |
As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
The GlobalFoundry strategy is straight forward so let’s start there. GFI is partnering with leading design enablement companies to advance semiconductor design at the 28nm node. GFI is committed to becoming the FIRST SOURCE for 28nm, competing directly with TSMC, while other foundries have in the past offered “T” like processes for 2nd and 3rd source manufacturing strategies (UMC, Chartered Semi, SMIC).
Related Blogs
- Why, How and What of Custom SoCs
- ARM vs RISC-V: Beginning of a new era
- Ecosystem Collaboration Drives New AMBA Specification for Chiplets
- Mitigating Side-Channel Attacks In Post Quantum Cryptography (PQC) With Secure-IC Solutions
- Intel Embraces the RISC-V Ecosystem: Implications as the Other Shoe Drops