Industry Expert Blogs
QFN Package OverviewAnySiliconJan. 21, 2013 |
QFN package is probably the most successful package type today. QFN package offers low price, excellent performance and small size –therefore it is an ideal package for many applications.
QFN (quad-flat no-leads) is a plastic SMT package consists of: a leadframe, single or multiple dies, wirebonds and a molding compound. The leadframe is the heart of the package and therefore the size and the dimensions of the leadframe will determine the overall performance of the package.