Industry Expert Blogs
TSMC OIP: On the Road to the Silicon Super ChipThe Fuller View Blog - Brian FullerOct. 07, 2013 |
SAN JOSE, Calif.--If you're the world's largest foundry, there's no slowing down, especially if you're roaring down the road to the "silicon wafer-based silicon super chip."
That was my take-away earlier this week (Oct. 1) listening to TSMC Vice President of R&D and CTO Dr. Jack Sun during TSMC's Open Innovation Platform® (OIP) event here at Cadence headquarters.
From 20nm system-on-chip (SoC) production, to the ramp of 16nm FinFETs, to 7- and 5-nm technologies in the distant future, and R&D and capacity investments in between, the pace of innovation at the Taiwanese company seems faster than ever.
Related Blogs
- Intel Embraces the RISC-V Ecosystem: Implications as the Other Shoe Drops
- Moortec "Let's Talk PVT Monitoring" Series with CTO Oliver King
- Ecosystem Collaboration Drives New AMBA Specification for Chiplets
- Obsolete & EOL Parts
- Extending Arm Total Design Ecosystem to Accelerate Infrastructure Innovation