Industry Expert Blogs

Did you go to IEDM 2013 in Washington DC ? You may have attended to the “Advanced CMOS Technology Platform” chaired by TSMC, and listen to the FD-SOI related presentation “High Performance UTBB FDSOI Devices Featuring 20nm Gate Length for 14nm Node and Beyond”. According with the abstract, this paper is the first time report of “high performance Ultra-thin Body and Box (UTBB) FDSOI devices with a gate length (LG) of 20nm and BOX thickness (TBOX) of 25nm, featuring dual channel FETs (Si channel NFET and compressively strained SiGe channel PFET).” If you didn’t go to Washington DC, or not familiar with FD-SOI, having a look at FD-SOI device architecture could help.

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