400G ultra low latency 56/112G FEC and SERDES IP sub 10ns latency
Industry Expert Blogs
The State of 450mm Wafers. And Intel GossipSemiWiki - Paul McLellanJan. 15, 2014 |
Paul Farrar, the General Manager of the Global 450mm Consortium (G450C) presented at the SEMI ISS conference today. What is G450C, it is a public-private consortium to develop a cost-effective 450mm wafer fabrication infrastructure, develop equipment prototypes and coordinate the industry move to 450mm. It is located in Albany New York and its main partners are Intel, TSMC, Samsung, GlobalFoundries, IBM and the state of New York. The current plans call for work to take place over the next 3 or 4 years and be ready for volume manufacturing in 2018 or 2019. At the end of last year they had 41 450mm tools either in Albany or at partner companies or at suppliers (tools just means pieces of equipment like a stepper). They have a 45,000 square foot clean room.
Related Blogs
- Intel Embraces the RISC-V Ecosystem: Implications as the Other Shoe Drops
- Obsolete & EOL Parts
- Mitigating Side-Channel Attacks In Post Quantum Cryptography (PQC) With Secure-IC Solutions
- Extending Arm Total Design Ecosystem to Accelerate Infrastructure Innovation
- Ecosystem Collaboration Drives New AMBA Specification for Chiplets