1.8V/3.3V I2C 5V Failsafe Failtolerant Automotive Grade 1 in GF (12nm)
Industry Expert Blogs
Mobile World Congress: Two New Audio IP AnnouncementsThe Fuller View Blog - Brian FullerMar. 17, 2015 |
BARCELONA, Spain—Mobile World Congress is not surprisingly focused on mobile devices, applications, and services. And the Cadence Tensilica team, which has been attending this event for a decade, generally has something up its sleeves when the booth opens for business each year.
This time was no exception. The company announced that DTS’s Headphone:X immersive sound technology has been optimized for the Cadence Tensilica HiFi Audio/Voice DSPs and, separately, that Waves MaxxVoice technology has been ported to and optimized for HiFi.
Related Blogs
- Intel Embraces the RISC-V Ecosystem: Implications as the Other Shoe Drops
- Arm and Arteris Drive Innovation in Automotive SoCs
- Extending Arm Total Design Ecosystem to Accelerate Infrastructure Innovation
- Decipher the Meaning of Silicon-as-a-Service
- What is Spatial Audio and What Does it Have To Do With Binaural Audio?