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MIPI C-PHY v1.2 D-PHY v2.1 TX 3 trios/4 Lanes in TSMC (16nm, 12nm, N7, N6, N5, N3E)
Industry Expert Blogs
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ARM-Cadence IP Deal Propels Engineering Innovation Ahead: Martin LundThe Fuller View Blog - Brian FullerMar. 19, 2015 |
On March 18, Cadence and ARM announced a groundbreaking deal that provides reciprocal access to relevant IP portfolios from the Cadence IP Group and ARM. The agreement grants both companies rights to manufacture test chips containing Cadence IP and ARM IP and to provide development platforms to customers. I sat down with Martin Lund, Senior Vice President of Cadence’s IP Group, to talk about the deal.
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