Industry Expert Blogs

Modern fabs use 300mm (12") wafers. Older fabs have used 200mm (8") wafers since the early '90s, starting with IBM Fishkill's pilot with Siemens to build 64Mb DRAM in 1990. Before that, we had 5" wafers (150mm), and if you go back far enough in history, you'll find 4", 2", and even 1" when integrated circuits started. 300mm started in 2000 with Siemens/Motorola (and two beta lines in the US at l300l and Japan at Selete).

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