Industry Expert Blogs
MIPI inside Augmented Reality HeadsetsOn the Move - Hezi SaarAug. 26, 2016 |
Microsoft shared some interesting details about their 28nm SoC design targeting augmented reality headset. Well, that is not just a processor, it’s custom vision processor which Microsoft calls HoloLens Processing Unit (HPU) as it is specifically targeting the augmented (possibly also virtual) reality needs.
It is very interesting to see the computing power that was implemented on the chip to accommodate the imaging algorithms that used. The interfaces used on this chip are referenced as PCIe, DDR and MIPI. As the HPU uses several camera interfaces, depth and motion sensor for image identification and processing, recognizing gestures it’s clear that MIPI Camera and Display interfaces are probably used extensively. As per the die plot provided, the MIPI interfaces take a very small area of the processor compared to the computing blocks that are dominant utilizing 24 cores.
Related Blogs
- Digitizing Data Using Optical Character Recognition (OCR)
- Mitigating Side-Channel Attacks In Post Quantum Cryptography (PQC) With Secure-IC Solutions
- Intel Embraces the RISC-V Ecosystem: Implications as the Other Shoe Drops
- Why, How and What of Custom SoCs
- Vivante Vega GPU Geometry and Tessellation Shader Overview