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GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory (HBM) solutionRambus BlogAug. 09, 2017 |
GLOBALFOUNDRIES has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for application-specific integrated circuits (ASICs).
According to Kevin O’Buckley, VP of ASIC product development at GF, the 2.5D ASIC solution includes a stitched interposer capability to overcome lithography limitations and a two terabits per second (2Tbps) multi-lane HBM2 PHY, developed in partnership with Rambus. Building on the 14nm FinFET demonstration, the solution will be integrated on the company’s next-generation FX-7™ ASIC design system built on GF’s 7nm FinFET process technology.
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