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55nmHV MTP Non Volatile Memory for Standard CMOS Logic Process
Industry Expert Blogs
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Mali-G72 High Performance GPU debuts in HiSilicon's Kirin 970 SoCarm Blogs - Freddi Jeffries, ARMSep. 20, 2017 |
For those of us who arguably take our tech a little too seriously, the first time a brand new product appears in real-life silicon is pretty exciting. I imagine it’s a bit like an architect seeing a house for the first time rather than a series of drawings, and it makes the whole process feel worthwhile. When that product is appearing in the silicon that will power a ground-breaking, next generation flagship device from one of our fastest growing partners, it gets even more exciting. This is where Huawei, and their in-house SoC designer, HiSilicon, come in. After an announcement that wasn’t quite an announcement came Huawei’s all-important IFA keynote, providing a lot more detail about the Kirin 970 SoC and the two major devices it will initially power.
