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2.5D Multi-Core Raster & Vector Graphics Processor for low-power SoCs with Microcontroller
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Rambus highlights HBM2 PHY collaboration at GLOBALFOUNDRIES Technology ConferenceRambus BlogSep. 21, 2017 |
We are showcasing our HBM2 PHY at the GLOBALFOUNDRIES Technology Conference at the Hyatt Regency Santa Clara (table #6). Designed for systems that require low latency and high bandwidth memory, our HBM2 PHY is built on GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology.
The PHY is fully compliant with the JEDEC HBM2 standard and supports data rates up to 2000 Mbps per data pin, resulting in a total bandwidth of 256 GB/s. The interface features 8 independent channels, each containing 128 bits for a total data width of 1024 bits, as well as support for a stack height of 2, 4 or 8 DRAMs. The PHY is also designed for a 2.5D system with an interposer for routing signals between the DRAM and PHY.
