English
Industry Expert Blogs
|
It's time to take the UltraSoC vision to the next level: design for product lifecycleUltraSoC Blog - Rupert Baines, UltraSoCJun. 24, 2020 |
What a momentous day this is. After five years in the role of CEO at UltraSoC, I am proud that we have agreed to become a part of Siemens, in a move that we knew made perfect sense from the time of our first meetings. It is striking just how clearly aligned our visions are.
The pieces of the jigsaw fit together so nicely: UltraSoC’s technology and history with its customers; where Tessent is coming from and its market-leading design-for-test offering; and the broader vision of Siemens Digital Industries. The combination takes us to another level: product lifecycle management is such a significant big-picture opportunity, as is cybersecurity and the concept of the Digital Twin. Tessent and UltraSoC bring the core semiconductor element to that broader story, making it perfectly balanced. Tessent brings IP into the chip to improve test and manufacturability; UltraSoC enhances the validation process and extends that into field deployment. Overall, the combination enables a truly complete design for product lifecycle offering.
Related Blogs
- Intel Embraces the RISC-V Ecosystem: Implications as the Other Shoe Drops
- Mitigating Side-Channel Attacks In Post Quantum Cryptography (PQC) With Secure-IC Solutions
- ARM vs RISC-V: Beginning of a new era
- Experts Talk: RISC-V CEO Calista Redmond and Maven Silicon CEO Sivakumar P R on RISC-V Open Era of Computing
- The Real Case of Silicon-as-a-Service - A Tale of 3 Innovators