MIPI C-PHY v1.2 D-PHY v2.1 TX 3 trios/4 Lanes in TSMC (16nm, 12nm, N7, N6, N5, N3E)
Industry Expert Blogs
Moving AMBA forward with multi-chip and CHI C2Carm Blogs - Francisco Socal, ArmMay. 02, 2023 |
AMBA has a long history of collaborating with the ecosystem to solve complex and industry-wide problems. Now, as the industry embraces chiplets, is the time to extend AMBA from on-chip to multi-chip.
In this blog, we outline AMBA’s approach with CHI C2C – an extension to on-chip CHI that is being developed to make CHI suitable for connecting chip(let)-to-chip(let).
We also illustrate how AMBA CHI C2C will complement chiplet standardization efforts like UCIe, with a view to drive further alignment and collaboration.
Why chiplets and why now?
Related Blogs
- Ecosystem Collaboration Drives New AMBA Specification for Chiplets
- Extending Arm Total Design Ecosystem to Accelerate Infrastructure Innovation
- Arm Ecosystem Collaborates on Standards to Enable a Thriving Chiplet Market
- Intel Embraces the RISC-V Ecosystem: Implications as the Other Shoe Drops
- Why, How and What of Custom SoCs