Tower's 0.18-micron Technology Platform Enables QuickLogic to Ramp Production of Power-Optimized Eclipse II Products

Joint Achievements Open up New Markets for Both Companies

MIGDAL HAMAEK, Israel & SUNNYVALE, Calif.--(BUSINESS WIRE)--April 6, 2005--Tower Semiconductor Ltd. and QuickLogic corporation announced today that newly updated performance data on the QuickLogic Eclipse II family of uWatt FPGA products clearly establishes a new industry benchmark in low power performance. Manufactured in a 0.18-micron, six-layer metal CMOS process, the Eclipse II family features standby currents as low as 14 micro-Amps.

"Tower's advanced technology platform, supported by excellent customer service, combined to give our products a competitive edge for applications where every micro-Watt counts," said Tom Hart, QuickLogic's Chairman, President and CEO. "QuickLogic's uWatt FPGA and uWatt Programmable Bridging products are gaining significant traction in the portable application space. Additionally, the devices' support of the industrial temperature range makes them ideally suitable for rugged working environments, where active cooling systems or heat sinks are not feasible due to reliability or form factor requirements."

QuickLogic uWatt programmable technology provides designers of mobile embedded systems multiple solutions for applications that demand ultra-low power. Eclipse II devices are smaller and consume less power compared to SRAM and Flash-based FPGAs and offer higher system performance than CPLDs. They are enabling predominantly connectivity and bridging functions in a variety of handheld and wireless applications such as PDAs, tablet PCs, Smartphones and gaming.

"The move to Tower's 0.18-micron process, as well as the intense engineering collaboration between our companies enhanced the product's low leakage, low power characteristics," said Doron Simon, president of Tower Semiconductor USA, Inc. "Tower's 0.18-micron technology platform has enabled QuickLogic to ramp production of an optimized set of programmable products, opening up new high volume market opportunities for both companies."

About QuickLogic

QuickLogic Corporation invented and has pioneered the Embedded Standard Product (ESP) architecture, with the introduction of first products in 1998. ESPs are semiconductor devices that deliver the guaranteed performance, lower cost and lower risk of standard products, coupled with the flexibility and time-to-market benefits of programmable logic. QuickLogic's proprietary ViaLink metal-to-metal interconnect technology offers significant benefits -- including very low power at high performance levels -- to our customers and is the foundation of our ESP product families, as well as our core FPGA products. Founded in 1988, the company is located at 1277 Orleans Drive, Sunnyvale, CA 94089-1138. For more information please visit the QuickLogic web site at www.quicklogic.com.

About Tower Semiconductor Ltd.

Tower Semiconductor LTD. is a pure-play independent wafer foundry established in 1993. The company manufactures integrated circuits with geometries ranging from 1.0 to 0.13 micron; it also provides complementary technical services and design support. In addition to digital CMOS process technology, Tower offers advanced non-volatile memory solutions, mixed-signal and CMOS image-sensor technologies. To provide world-class customer service, the company maintains two manufacturing facilities: Fab 1 has process technologies from 1.0 to 0.35 micron and can produce up to 16,000 150mm wafers per month. Fab 2 features 0.18-micron and below process technologies, including foundry-standard technology and can produce today up to 15,000 200mm wafers per month. The Tower web site is located at www.towersemi.com.

Safe Harbor

This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect our business is included under the heading "Risk Factors" in our most recent Annual Report on Forms 20-F and 6-K, as were filed with the Securities and Exchange Commission and the Israel Securities Authority.