Foundries should drive IP quality
![]() | |
EE Times: Foundries should drive IP quality | |
Kurt A. Wolf (04/18/2005 9:00 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=160901316 | |
The future success of the IC industry rests heavily on system-on-chip design. Long-term growth depends on our ability to value relationships between SoC design teams and intellectual-property companies. Proactive and diligent IP management directly influences the success of those efforts.
Proactive collaboration among IP users, foundry and IP suppliers is at a remarkably early stage, however. Most IP is still verified as isolated blocks and does not consider chip-level interdependencies. In addition, various IP verification methodologies are just now coming into use. As a result, the potential value and productivity gains that would result from reintegrating the IC design chain are not always delivered. To address this, TSMC proposes a new model in which IP partnerships are selective and actively managed; IP uniqueness is adaptively managed; and quality is rigorously evaluated so it can be used as a primary criterion in the purchasing decision. This is best accomplished by creating a new SoC team member: the chief IP officer.
IP selection is directly related to the intended function of the target SoC. This means there will be varying degrees of integration with manufacturing processes. Often, other IP is required. The overall responsibility for ensuring IP quality thus rests with all three parties to the design effort: IP developers, device designers and foundries. While proactive management of this process is the responsibility of all parties, the foundries must serve as the main driver for this activity.
By Kurt A. Wolf, director of R&D, and Kenneth C. Weng, deputy director of library and IP quality management, Library and IP Management Division at Taiwan Semiconductor Manufacturing Co. Ltd.
| |
- - | |
Related News
- DxO Labs Programmable Core and Image Processing Technology Designed to Drive State-of-the-Art Image Quality for Connected Devices
- Commentary: ESL should drive emulation
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- Groundbreaking Formal Verification Further Enhances the Quality of CHERIoT-Ibex
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |