Foundries should drive IP quality
EE Times: Foundries should drive IP quality | |
Kurt A. Wolf (04/18/2005 9:00 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=160901316 | |
The future success of the IC industry rests heavily on system-on-chip design. Long-term growth depends on our ability to value relationships between SoC design teams and intellectual-property companies. Proactive and diligent IP management directly influences the success of those efforts.
Proactive collaboration among IP users, foundry and IP suppliers is at a remarkably early stage, however. Most IP is still verified as isolated blocks and does not consider chip-level interdependencies. In addition, various IP verification methodologies are just now coming into use. As a result, the potential value and productivity gains that would result from reintegrating the IC design chain are not always delivered. To address this, TSMC proposes a new model in which IP partnerships are selective and actively managed; IP uniqueness is adaptively managed; and quality is rigorously evaluated so it can be used as a primary criterion in the purchasing decision. This is best accomplished by creating a new SoC team member: the chief IP officer.
IP selection is directly related to the intended function of the target SoC. This means there will be varying degrees of integration with manufacturing processes. Often, other IP is required. The overall responsibility for ensuring IP quality thus rests with all three parties to the design effort: IP developers, device designers and foundries. While proactive management of this process is the responsibility of all parties, the foundries must serve as the main driver for this activity.
By Kurt A. Wolf, director of R&D, and Kenneth C. Weng, deputy director of library and IP quality management, Library and IP Management Division at Taiwan Semiconductor Manufacturing Co. Ltd.
| |
- - | |
Related News
- DxO Labs Programmable Core and Image Processing Technology Designed to Drive State-of-the-Art Image Quality for Connected Devices
- Commentary: ESL should drive emulation
- Mature Process Capacity to Grow 6% in 2025; Chinese Foundries Lead Expansion
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
- Expedera Appoints Siyad Ma as New CEO to Drive Expansion, Innovation
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |