A matter of the design chain
![]() | |
EE Times: A matter of the design chain | |
Mark Templeton (04/18/2005 9:00 AM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=160901315 | |
Four critical technologies must come together for the success of a chip design: commercial intellectual property; electronic design automation tools and flows; foundry process information; and the design team's own custom design and chip assembly technique. Let's look at each in turn.
Most commercial IP is high-integrity and low-risk. It has usually been proven in silicon on tens, hundreds or possibly thousands of designs across a large number of processes. A similar argument can be made for commercial design tools. The user community for leading EDA tools is huge. By and large, EDA tool quality is outstanding. Occasionally, a design may fail because a simulation or verification step was not performed thoroughly, but rarely is a tool to blame.
The third critical piece of the puzzle is the foundry's own process models, DRC flows, etc. Even the smallest issue with this level of process abstraction can lead to poor results. Most foundries have become expert at establishing and exhaustively testing these models. Still, it is common for a new process to undergo a transition once volume experience is gained from early customer designs.
The circuitry newly created by the designers will rely totally on the accuracy of the process information, the analysis of the design tools and the skill of the design team. This is where the opportunity is and where the strong design chain partnerships that exist among the foundry, EDA vendors, IP vendors, flow developers and, of course, the actual chip design team come into play.
By Mark Templeton, president and chief executive officer of Artisan Components Inc.
| |
- - | |
Related News
- Siemens advances integrated circuit test and analysis at 5nm and below
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio
- Apple-TSMC-Amkor Pact Bolsters U.S. Chip Supply Chain
- proteanTecs Collaborates with BAE Systems to Enable a Zero Trust Supply Chain for Defense Applications
Breaking News
- Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
- Quadric Announces Lee Vick is New VP Worldwide Sales
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |