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DongbuAnam Extends ShuttleChip Program to Verify 130nm Prototype Chip Designs Using Copper Interconnects
SEOUL, Korea -- May 2, 2005 - DongbuAnam Semiconductor today announced that its ShuttleChip™ Program can now verify 130nm prototype chip designs with up to eight layers of copper interconnect. Expected to appeal to fabless companies worldwide, the 130nm/copper process addition to DongbuAnam’s ShuttleChip™ Program will be offered three times this year, beginning on June, 2005.
“Thanks to our ShuttleChip Program, our customers can drive down manufacturing costs by sharing a single mask set to verify prototype designs in silicon before committing to volume production,” said Jae Song, EVP of Strategic Business Development for DongbuAnam. “Our early ShuttleChip engagement with customers also enables us to accommodate special requirements rapidly and reduce time to high volume production.”
According to Song, DongbuAnam’s 130nm/copper ShuttleChip process is identical to the high-volume production process being used to produce system-on-chip solutions for advanced wireless and consumer electronics applications. “This superb process features a triple-well option plus a poly transistor gate length as small as 110nm to support standard-logic, high-performance, and low-power chip designs,” he added. He noted that the 130nm/copper ShuttleChip process can also be used to validate digital/analog intellectual property, cell libraries, I/O functions and other circuit elements.
About DongbuAnam Semiconductor
DongbuAnam Semiconductor, one of the largest pure-play wafer foundries in the world, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. DongbuAnam is a key global supplier within Korea"s well-established semiconductor manufacturing infrastructure. The company’s stock trades on the Korea Stock Exchange under the stock code 001830. For more information, visit www.dsemi.com.
“Thanks to our ShuttleChip Program, our customers can drive down manufacturing costs by sharing a single mask set to verify prototype designs in silicon before committing to volume production,” said Jae Song, EVP of Strategic Business Development for DongbuAnam. “Our early ShuttleChip engagement with customers also enables us to accommodate special requirements rapidly and reduce time to high volume production.”
According to Song, DongbuAnam’s 130nm/copper ShuttleChip process is identical to the high-volume production process being used to produce system-on-chip solutions for advanced wireless and consumer electronics applications. “This superb process features a triple-well option plus a poly transistor gate length as small as 110nm to support standard-logic, high-performance, and low-power chip designs,” he added. He noted that the 130nm/copper ShuttleChip process can also be used to validate digital/analog intellectual property, cell libraries, I/O functions and other circuit elements.
About DongbuAnam Semiconductor
DongbuAnam Semiconductor, one of the largest pure-play wafer foundries in the world, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. DongbuAnam is a key global supplier within Korea"s well-established semiconductor manufacturing infrastructure. The company’s stock trades on the Korea Stock Exchange under the stock code 001830. For more information, visit www.dsemi.com.
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