English
DongbuAnam Extends ShuttleChip Program to Verify 130nm Prototype Chip Designs Using Copper Interconnects
SEOUL, Korea -- May 2, 2005 - DongbuAnam Semiconductor today announced that its ShuttleChip™ Program can now verify 130nm prototype chip designs with up to eight layers of copper interconnect. Expected to appeal to fabless companies worldwide, the 130nm/copper process addition to DongbuAnam’s ShuttleChip™ Program will be offered three times this year, beginning on June, 2005.
“Thanks to our ShuttleChip Program, our customers can drive down manufacturing costs by sharing a single mask set to verify prototype designs in silicon before committing to volume production,” said Jae Song, EVP of Strategic Business Development for DongbuAnam. “Our early ShuttleChip engagement with customers also enables us to accommodate special requirements rapidly and reduce time to high volume production.”
According to Song, DongbuAnam’s 130nm/copper ShuttleChip process is identical to the high-volume production process being used to produce system-on-chip solutions for advanced wireless and consumer electronics applications. “This superb process features a triple-well option plus a poly transistor gate length as small as 110nm to support standard-logic, high-performance, and low-power chip designs,” he added. He noted that the 130nm/copper ShuttleChip process can also be used to validate digital/analog intellectual property, cell libraries, I/O functions and other circuit elements.
About DongbuAnam Semiconductor
DongbuAnam Semiconductor, one of the largest pure-play wafer foundries in the world, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. DongbuAnam is a key global supplier within Korea"s well-established semiconductor manufacturing infrastructure. The company’s stock trades on the Korea Stock Exchange under the stock code 001830. For more information, visit www.dsemi.com.
“Thanks to our ShuttleChip Program, our customers can drive down manufacturing costs by sharing a single mask set to verify prototype designs in silicon before committing to volume production,” said Jae Song, EVP of Strategic Business Development for DongbuAnam. “Our early ShuttleChip engagement with customers also enables us to accommodate special requirements rapidly and reduce time to high volume production.”
According to Song, DongbuAnam’s 130nm/copper ShuttleChip process is identical to the high-volume production process being used to produce system-on-chip solutions for advanced wireless and consumer electronics applications. “This superb process features a triple-well option plus a poly transistor gate length as small as 110nm to support standard-logic, high-performance, and low-power chip designs,” he added. He noted that the 130nm/copper ShuttleChip process can also be used to validate digital/analog intellectual property, cell libraries, I/O functions and other circuit elements.
About DongbuAnam Semiconductor
DongbuAnam Semiconductor, one of the largest pure-play wafer foundries in the world, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. DongbuAnam is a key global supplier within Korea"s well-established semiconductor manufacturing infrastructure. The company’s stock trades on the Korea Stock Exchange under the stock code 001830. For more information, visit www.dsemi.com.
|
||||||
Related News
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
- Synopsys Extends DesignWare Security, Processor IP Solutions to Address Safety and Security Requirements of Automotive Designs
- NanoSemi Relies on OneSpin Automated Formal Verification Tools to Verify SystemC Designs for 5G ASICs
- Wave Computing Releases First MIPS Open Program Components to Accelerate Innovation for Next-Generation System on Chip Designs
- Mentor extends functional safety assurance program to key design, verification and analog/mixed signal products
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
|
E-mail This Article | 
|
|
Printer-Friendly Page |