Jennic appoints Mike Clancy as VP, worldwide sales to exploit potential in the wireless sensor market

Sheffield, UK, 11 May 2005: As part of its strategy to exploit the low power wireless sensor market – forecast by West Tech Research to exceed 550 million units in 2009 – fabless chip firm Jennic has appointed Mike Clancy as VP worldwide sales. Clancy joins the company from Wolfson Microelectronics, where as vice president of worldwide sales he increased sales to $120million over 16 successive quarters.

 

Mike Clancy has over 20 years semiconductor industry experience in senior sales and management roles. He was a key member of the team that saw Wolfson transition from a services company through a public offering in 2003. Prior to that Clancy held a senior international sales position at GEC Plessey Semiconductor where he was responsible for all sales activity in the Asia Pacific region.

 

Jim Lindop, CEO and founder of Jennic commented, "Based on our strong track record in engineering Jennic has developed a single-chip solution for wireless sensor networks based on the IEEE802.15.4 standard that is smaller, cheaper and lower power than other solutions. I look forward to Mike bringing his firmly established experience and track record in sales to take our technology to market. He has had particular success in major companies in Asia and I have every confidence in him building a first class worldwide sales channel for Jennic."

 

About Jennic

Jennic is a fabless semiconductor company leading the wireless connectivity revolution into new applications. Its expertise in systems and software combined with world class RF and digital chip design provides low cost, highly integrated silicon solutions for the low power sort range wireless data market with a focus on the IEEE802.15.4 and ZigBee standards. The company's products include state-of-the-art low power wireless microcontrollers, transceivers and low cost development platforms. Headquartered in Sheffield, UK, and employing over 60 people, Jennic is privately held and has a track record of successful silicon chip development for wireless applications over the last nine years.