TTPCom's AJAR 3G to dramatically accelerate mass-market feature phone development
Cambridge, UK, 26 May 2005. TTPCom today announced the release of AJAR 3G, the industry’s most comprehensive environment for mass-market feature-phone software. AJAR 3G is supported by over thirty pre-integrated TTPCom applications and over twenty from leading third party partners. As AJAR 3G is designed to accelerate time to market for mass-market phones, customers can expect to reach production in less than four months from a standing start using fewer engineering resources than would normally be required.
TTPCom AJAR 3G builds on the successful 2G/2.5G version to enable a single applications investment in products used across multiple networks (2G, 2.5G, EDGE, 3G and HSDPA), multiple architectures (single processor, coprocessor, application processor) and different handset designs (candy bar, clamshell). AJAR 3G is also compatible with multiple cellular chipsets (including ADI and Intel) across a range of handsets from low- to high-end. Furthermore, AJAR has been optimised for mass-market feature phones to enable a significantly lower bill of materials (BoM) than Open OS platforms.
According to Steven Baker, Marketing Director for TTPCom’s Software business unit: “Application requirements for 3G are growing: integration and testing is time consuming, complex and risky owing to the interactions between applications. Meanwhile, handset manufacturers want to use multiple hardware platforms to serve different market needs. In addition, operators and Original Equipment Manufacturers (OEMs) demand ‘deep customisation’—their logo on the splash screen is not enough. AJAR 3G addresses these challenges directly with a single investment in applications.”
AJAR 3G customers benefit from the industry’s richest set of components and applications that enable the rapid development of complex yet adaptable phones with the minimum integration effort. The modular applications extend from the basic features expected in any phone, to the multimedia functions required for 3G and applications including Java™, 3D graphics, streaming video/audio media players and video telephony.
Baker added, “Manufacturers have the freedom to design a range of handsets by choosing the most effective and economic modem and protocol stack for each model, in the confidence that all of the application software will be consistent. They can re-use the same set of applications across a range of models, creating a rich environment for high-end models, and a simpler package for voice-only phones.”
AJAR’s unique architecture delivers a high level of differentiation. Handset developers can specify models with a combination of TTPCom, partner or in-house applications to meet specific market or network requirements. This characteristic also allows manufacturers to quickly refresh handsets to develop product variants rapidly for different market segments or to add the latest ‘killer application’ to extend product life without the need for extensive software redevelopment.
In addition to the extensive portfolio of pre-integrated applications, AJAR offers handset developers a productivity toolset for the development and testing of applications and user interfaces. One of these tools, DZigner, can be used to create an entirely new User Experience (UE) quickly and easily. Handset manufacturers can therefore expect to reduce the number of engineers involved in the development of a single UE from over one hundred to approximately twenty. This powerful functionality is used by Original Design Manufacturers (ODMs) to create a different look and feel for each new customers using the same base technologies. Handset manufacturers use DZigner not only to customise handsets for operators but also to ensure consistency of branding across a large product portfolio, whether developed internally or outsourced.
The third party applications available with AJAR 3G include: Bluetooth functionality from CSR, 3D graphics from Hybrid, Voice recognition from Scansoft, predictive text capability from Tegic and Zi, Java from Esmertec and games from Kayak Interactive to name but a few. The pre-integrated and comprehensive nature of the AJAR platform enables a fast time to market and low risk solution for handset manufacturers, who also benefit from a single point of contact and support.
About TTPCom
Based in Cambridge, UK, TTPCom Ltd. is the principal operating subsidiary of TTP Communications plc (LSE: TTC). The company develops intellectual property used in the design and manufacture of wireless communication terminals. TTPCom licenses its technology to leading semiconductor and terminal manufacturers worldwide, including Analog Devices, Intel, LG, Renesas, Sharp and Siemens.
TTPCom has established a world leading position with its GPRS, EDGE and 3G protocol software and offers rapid customisation of handsets through its AJAR applications framework. Over 40 million devices using TTPCom technology were shipped during 2004. More information can be found on TTPCom’s website at: http://www.ttpcom.com/.
|
Related News
- Agere Systems Drives Mass-Market Evolution for Enhanced- Feature Mobile Phones with New Advanced Multimedia Framework
- Amoi Mobile selects TTPCom's AJAR for multiplatform in feature phones
- Agere Systems Announces General Availability of a Dual-Mode UMTS/EDGE, W-EDGE Baseband Solution for Mass-Market Multimedia Mobile Phones
- SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development
- SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |