English
SMIC Beijing Secures Financing for Expansion
BEIJING – May 26, 2005 – Semiconductor Manufacturing International Corporation (“SMIC”) (NYSE: SMI; SEHK: 0981) today announced that its wholly-owned subsidiary, Semiconductor Manufacturing International (Beijing) Corporation (“SMIC Beijing”), has entered into a US$600 million 5-year loan facility from a group of banks based in the People’s Republic of China (the “Loan”). China Development Bank and China Construction Bank co-led the arrangement of the Loan with other participants which include Bank of China, Agricultural Bank of China, China Merchants Bank, HuaXia Bank, China MingSheng Bank, Bank of Communications, Bank of Beijing, Industrial and Commercial Bank of China (Asia) and CITIC Ka Wah Bank. The proceeds of the Loan will help to expand the capacity at SMIC’s three 300-mm fabs located in Beijing. SMIC will guarantee SMIC Beijing’s obligations under the Loan.
Dr. Richard R. Chang, Chief Executive Officer of SMIC, said, “We are pleased to receive the support of our Chinese banking partners to finance a portion of SMIC Beijing’s ongoing capital requirements for its expansion plans. We plan to fund our future expansion by both internally generated cashflow and additional loans to be obtained from financial institutions.”
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 0.11-micron and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In the first quarter of 2005, SMIC commenced commercial production at its 12-inch wafer fabrication facility in Beijing. SMIC also maintains customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. As part of its dedication towards providing high-quality services, SMIC strives to comply with or exceed international standards and has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000, and ISO14001 certifications. For additional information, please visit http://www.smics.com/.
Dr. Richard R. Chang, Chief Executive Officer of SMIC, said, “We are pleased to receive the support of our Chinese banking partners to finance a portion of SMIC Beijing’s ongoing capital requirements for its expansion plans. We plan to fund our future expansion by both internally generated cashflow and additional loans to be obtained from financial institutions.”
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 0.11-micron and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In the first quarter of 2005, SMIC commenced commercial production at its 12-inch wafer fabrication facility in Beijing. SMIC also maintains customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. As part of its dedication towards providing high-quality services, SMIC strives to comply with or exceed international standards and has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000, and ISO14001 certifications. For additional information, please visit http://www.smics.com/.
|
||||||
SMIC Hot IP
Related News
- SMIC Tianjin Secures Financing for Expansion
- SMIC and Beijing Government Sign Cooperation Framework Document to Launch SMIC Beijing Second Phase Expansion Project
- VSORA Secures $4.2 Million in Financing from Otium Capital, Angel Investors
- Progress in Importation of US Equipment Dispels Doubts on SMIC's Capacity Expansion for Mature Nodes for Now, Says TrendForce
- SMIC Aims to Raise More Than $3B for Expansion
Breaking News
- Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs
- Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
- CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
- intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
- RISC-V in Space Workshop 2025 in Gothenburg
Most Popular
- Intel Halts Products, Slows Roadmap in Years-Long Turnaround
- UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips
- CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- RISC-V in Space Workshop 2025 in Gothenburg
|
E-mail This Article | 
|
|
Printer-Friendly Page |