IP core handles soft errors
![]() |
IP core handles soft errors
By Chris Edwards, EE Times UK
December 1, 2000 (8:34 a.m. EST)
URL: http://www.eetimes.com/story/OEG20001201S0015
Iroc Technologies has developed what it reckons is the first intellectual property (IP) core to handle soft errors caused by alpha radiation. Based on the Sparc version 8 architecture, the IP contains protection elements for memory cells and logic. The core has been put into a test chip made by STMicroelectronics on a 0.25µm. It runs at up to 100MHz. Dr Michael Nicolaidis, Iroc's chief technical officer, says the core has more than 98% soft error coverage and is cheaper to implement than designs based on traditional techniques that depend on duplicate processing elements. Eric Dupont, CEO, added: "In developing this processor using a commercial standard-cell library, we have proven that our methodology is the first cost-effective solution to deal with the soft errors issue in commodity systems."
Related News
- DIAMOND Project to Provide Integrated Diagnosis and Correction for Spec, Design and Soft Errors
- Soft errors become hard truth for logic
- iRoC launches radiation test shuttle service for soft errors
- Logic Design Solutions launches an EXFAT IP Soft Core for NVMe Host
- Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |