Taiwan plans SoC initiative
Taiwan plans SoC initiative
By Mike Pan, EE Times
January 8, 2002 (4:15 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020108S0065
TAIWAN, Taipei Taiwan's Industrial Development Bureau plans to launch a system-on-chip design initiative at the Nankang software park on the outskirts of the Taipei, the government said. Along with the SoC initiative, industry groups here said they also intend to form an IC design alliance this year. That alliance will include a design company that will oversee cooperation with companies in mainland China manufacturing CD players, DVD players and telecommunications gear. "Currently Taiwan is the second largest IC design center next to the U.S., but we need to upgrade to a more integrated, value-added orientation," said Hwang Tai-yang, director of the Office of the Committee for Information Industry Development, a part of Taiwan's Ministry of Economic Affairs. "Taiwan is moving beyond manufacturing operations and fulfilling OEM orders to building up independent IC designing capabilities to ride the major trend of developing SoCs for Int ernet and consumer-related products." Despite a global downturn in the semiconductor industry, the production value of Taiwan's IC design industry was expected to reach $3.41 billion in 2001, up from $3.29 billion in 2000, according to the Industrial Technology Information Service. The service also predicted that revenues from 2002 production are expected to reach $4.23 billion, a 24 percent increase. SoC developments of leading design houses would contribute to the increase, it said. Mike Pan is bureau chief for sister publication EE Times-Taiwan.
Related News
- Taiwan targets IC design as next expansion phase, plans SoC R&D park
- Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology
- Toshiba Plans Deployment of Synopsys TetraMAX II on Upcoming SoC Design
- ARM Extends Solutions for Custom SoC development in Embedded and IoT Markets
- TSMC Plans to Invest $16 Billion More in Taiwan Site
Breaking News
- Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
- CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
- intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
- RISC-V in Space Workshop 2025 in Gothenburg
- Dolphin Semiconductor strengthens its governance with two key Board appointments
Most Popular
- Intel Halts Products, Slows Roadmap in Years-Long Turnaround
- UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- RaiderChip unveils its fully Hardware-Based Generative AI Accelerator: The GenAI NPU
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
E-mail This Article | Printer-Friendly Page |