Sonics and TransEDA Collaborate to Advance OCP-Based Tool Flows

Contributions Part of a New Initiative Aimed at Creating Easier SoC Design Methodology MOUNTAIN VIEW, Calif. & LOS GATOS, Calif.--(BUSINESS WIRE)--June 1, 2005 -- Sonics® Inc., the premier supplier of system-on-chip (SoC) SMART Interconnects(TM), and TransEDA®, the leader in coverage and verification measurement solutions for electronic designs, jointly announced a technical collaboration resulting in the availability of new versions of TransEDA's Coverage and Coverability Analysis tool, and Automatic Protocol Verification tool optimized with Open Core Protocol (OCP) version 2.1 support. This agreement highlights the active and ongoing collaboration between leading OCP intellectual property companies, such as Sonics, and leading-edge EDA companies, such as TransEDA, to further advance the process used for implementing OCP-based SoCs for improved engineering efficiencies.

This alliance is part of the first phase in a new Sonics initiative to produce a reference methodology for SoC designs containing Sonics SMART Interconnects. Sonics chose TransEDA's VN-Cover as its primary code Coverability Analysis tool, and imPROVE-HPK to formally check IP compliance with the OCP.

"TransEDA's VN-Cover Coverability Analysis capabilities, combined with imPROVE-HPK, have already provided Sonics with valuable feedback and helped support some of the most demanding tasks faced by our customers," says Drew Wingard, chief technical officer at Sonics. "As a result, TransEDA is one of the first companies selected by Sonics for its reference design methodology initiative."

"Tapping Sonics' vast system knowledge played an important role in our product development to ensure that the new version of imPROVE-HPK linked to our unique Coverability Analysis technology, would meet the needs of SoC developers," says Jean-Luc Bouvresse, chief executive officer of TransEDA. "We were also excited to support Sonics in establishing a reference methodology for SoC design, and we will continue to help make successful the methodology transformation that OCP is bringing to the industry."

During its three-year OCP-IP consortium membership, and as an active contributor of the OCP formal verification working group, TransEDA has consistently increased its investments in OCP compliance verification. Most recently, TransEDA has added support for OCP 2.1 to its existing portfolio of verification solutions for OCP 1.0 and 2.0.

"We are now seeing increasingly extensive collaborations such as the Sonics - TransEDA effort within the Open Core Protocol community which continues to add to the existing infrastructure being used worldwide," says Ian Mackintosh, president of OCP. "These collaborations highlight the importance and value of OCP as a defacto standard for the SoC design industry."

About Sonics

Sonics, Inc. is the premier provider of SMART Interconnects that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics SMART Interconnects in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com

About TransEDA

TransEDA is a leading provider of coverage and verification measurement solutions for electronic designs. TransEDA provides advanced verification and verification closure management solutions including code coverage with coverability analysis and test suite optimization capabilities, specification coverage and impact analysis, configurable HDL rule checking with automatic formal checks, static assertion verification, automatic bus protocol checking, verification IP with bus-based system-level test automation, and transistor-level functional abstraction. TransEDA is part of the Valiosys Group and has offices in North America, Europe and Japan, plus local representatives in China, India, Korea, Singapore and Taiwan. For more information, visit www.transeda.com.

Sonics is a registered trademark and SMART Interconnects is a trademark of Sonics, Inc. TransEDA, the TransEDA logo and Verification from Concept to Reality are registered trademarks of TransEDA Technology Ltd. All other trademarks are the property of their respective owners.