LSI Logic Licenses ZSP500 to Renesas Technology for Mobile Applications
- ZSP500 digital signal processor selected by Renesas Technology for its optimal balance of performance, power and footprint
- Preference for flexible ZSP architecture grows as Renesas Technology joins list of industry leading companies utilizing the ZSP technology
MILPITAS, Calif., June 6, 2005 /PRNewswire-FirstCall via COMTEX/ -- The ZSP Product Division of LSI Logic Corporation (NYSE: LSI) today announced that it has licensed the ZSP500 digital signal processor (DSP) core to Renesas Technology Corp., Japan's largest semiconductor company. Taking advantage of the ZSP(R) architecture's optimized balance of performance, power and footprint, Renesas Technology will implement the ZSP500 core as part of next-generation solutions for wireless handset applications, a market experiencing extreme growth.
"The wireless mobile market is very big, especially in Asia. Mobile phone shipments to Asia Pacific, including Japan, are estimated at 319 million units in 2004, representing 45% of world shipments," said Will Strauss, president of analyst firm Forward Concepts. "With this type of market potential, the selection of the ZSP500 by Renesas Technology represents yet another significant design win for the ZSP architecture, which is building momentum in wireless designs."
The ZSP500 core, which delivers dual-MAC capabilities in an efficient footprint with low power consumption and best-in-class code density, is ideal for the demands of power-critical applications such as 3G devices. By licensing the ZSP500, Renesas Technology joins a growing list of leading semiconductor companies who are leveraging ZSP solutions for mobile wireless, multimedia and VoIP applications.
"Renesas Technology required a processor with a very small footprint that could handle the high performance demands of wireless designs," said Masayuki Hirokawa, senior manager of Renesas Technology Corp.'s Mobile SoC Design Department. "The power and performance of the ZSP500 core combined with the expert support of the ZSP team was a winning solution for our applications."
About the LSI Logic ZSP Processing Solutions
The ZSP Products Division of LSI Logic is a leading licensor of signal processing cores and solutions. The ZSP processor architecture enables customer innovation worldwide as the DSP of choice in many key vertical markets including 3G wireless handsets, multimedia and networked voice appliances. The ZSP roadmap offers a range of software compatible cores delivering performance points that meet the cost, power and efficiency constraints of today's SoC designs. A number of standard products are also available for lower volume designs and prototype implementations. ZSP Solution Partners augment the technology with world-class software tools, EDA modeling support and a large portfolio of application software.
About LSI Logic Corporation
LSI Logic Corporation focuses on the design and production of high- performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with standard-cell ASICs, Platform ASICs and standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com .
SOURCE LSI Logic Corporation
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Statements in this press release regarding LSI Logic's business which are not historical facts are "forward-looking statements" that involve risks and uncertainties. For a discussion of such risks and uncertainties, which could cause actual results to differ from those contained in the forward-looking statements, see "Risk Factors" in the Company's Annual Report or Form 10-K for the most recently ended fiscal year.
|
Related News
- Renesas Selects EVE's ZeBu-XXL for LSI Design for Mobile Phone
- Renesas Technology Starts Sample Shipments of SH-Mobile G3 System LSI Jointly Developed With NTT DoCoMo, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson for 3G Mobile Phone Handsets
- Yamaha Licenses Virage Logic Semiconductor IP for Next-Generation Mobile Phone Platform
- Sequans Communications Licenses LSI Logic ZSP(R) DSP Core for Broadband Wireless Market
- Datang Mobile Licenses Express Logic's ThreadX(R) RTOS for 3G-Wireless Phone Handsets
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |