HelloSoft Completes $16 Million Series B Financing Round
San Jose, CA, June 21, 2005 - HelloSoft, the leading supplier of signal processing technology and software-defined radio (SDR) solutions for VOIP, Wi-Fi, Cellular, and converged markets, announced today the closing of an oversubscribed $16 million series B financing. This round is led by Boston-based TD Capital Ventures with the participation from new investors Mitsui & Company Venture Partners, Entrepia Ventures, and current investors, including Venrock Associates, Sofinnova Ventures and Jump Startup.
"This latest round of funding demonstrates investors’ confidence in our management team, strategy and roadmap. The new investment will help HelloSoft accelerate its development of CelluLANTM for the burgeoning mobile multi-mode handset market. With its experienced team and a innovative technology portfolio, HelloSoft will continue focusing on the world's most advanced low-cost and low-power solutions," said Krishna Yarlagadda, CEO of HelloSoft.
"The convergence of Cellular, VoIP, and Wi-Fi technologies is inevitable and happening at a rate faster than expected. HelloSoft’s deep domain experience and expertise in each of these technologies makes the company uniquely positioned to take advantage of this opportunity. HelloSoft’s visionary solutions will enable cost-efficient mass deployment of multi-mode mobile communications devices for the converged marketplace," said Jim Goldinger, Director and Investment Partner of TD Capital Ventures.
"HelloSoft’s expertise in developing flexible signal processing architectures gives the company considerable credibility," said Will Strauss, President of Forward Concepts.
About HelloSoft, Inc.
HelloSoft is a leading supplier of signal processing technology and software-defined radio (SDR) solutions for VOIP, Wi-Fi, Cellular, and converged markets. A pioneer in VOIP solutions, combined with its WLAN and Cellular Intellectual Property (IP) Portfolio, HelloSoft’s solutions enable cost-efficient mass deployment of multi-mode mobile communications devices for the converged market place. The company is headquartered in San Jose, California with an R&D facility staffed with over 100 seasoned digital signal processing engineers in Hyderabad, India. HelloSoft’s customers include top tier semiconductor manufacturers and Original Device Manufacturers (ODMs) globally.
HelloSoft’s solutions are provided as a suite of integrated products that include DSP software, Networking software, RTL, complete reference designs and design services to customize these solutions to customer needs. Products that utilize one or more of HelloSoft's solutions include next-generation mobile phones, personal digital assistants, IP phones, set-top boxes, game consoles, residential gateways, enterprise and SOHO gateways, WLAN access points, carrier-class media gateways, soft switches, and mobile base stations.
About TD Capital Ventures
TD Capital Ventures invests in early and growth stage companies with significant technology assets and market opportunities that span multiple industry sectors. Specifically, TD Capital Ventures focuses on investments in enterprise software, IT infrastructure, semiconductors, and wireless and emerging technologies. TD Capital Ventures has 4 investment professionals with strong investment, technology and operating experience located in its Boston office.
TD Capital Ventures is an investment group of TD Capital. Established more than 30 years ago, TD Capital is the independent private equity arm of TD Bank Financial Group. TD Capital has approximately US$1.9 billion of capital under management through its offices located in Canada and the United States.
For more information on TD Capital and its investment groups, go to www.tdcapital.com.
All trademarks and tradenames used herein are the properties of their respective holders.
|
Related News
- Microbridge Technologies completes $5.5 million US round of Series B financing
- Achronix Completes First Close of $52 Million Series B Preferred Stock Financing
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Morse Micro Supercharges its Series B Funding Round with AU $30 Million Top-up from Major Superannuation Funds and Others
- Algolux Closes $18.4 Million Series B Round for Robust Computer Vision
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |