NEC Upgrades IP License Agreement with Tensilica
NEC Upgrades IP License Agreement with Tensilica
SANTA CLARA, Calif.--(BUSINESS WIRE)--Nov. 15, 2000--Tensilica® Inc., the leading supplier of configurable microprocessor core intellectual property (IP), disclosed today that NEC Corporation (Nasdaq:NIPNY) has executed a time-based license agreement for its flagship Xtensa(TM) III processor core and the recently introduced Vectra DSP engine.
Speaking for NEC, Makoto Tazaki, general manager of NEC's Network Node Division, said, ``Our previous experience with Xtensa has been an unqualified success. Not only have we been able to develop and implement custom processors in silicon for next generation communication products, our engineers have mastered the considerable power of the TIE language to truly optimize their designs. Now, with the addition of the Vectra DSP engine to Xtensa III's already broad capabilities, we see much faster time-to-market for our broadening system products.''
Bernie Rosenthal, Tensilica's vice president of Marketing and business development, said, ``After an extensive evaluation of our Xtensa technology, NEC determined that it was well-suited for their current and future needs in communications processing. Over the last half year, their unparalleled success using Xtensa in real-world System-on-Chip applications has encouraged them to broaden their use of our IP, and enter into a time-based arrangement with us.''
About NEC
NEC Corporation (Nasdaq:NIPNY; FTSE:6701q.l.) is a leading provider of internet solutions, dedicated to meeting the specialized needs of its customers in the key computer, network and electron device fields through its three market-focused in-house companies: NEC Solutions, NEC Networks and NEC Electron Devices. NEC Corporation, with its in-house companies, employs more than 150,000 people worldwide, and saw net sales of 4,991 billion Yen (approx. U.S. $48 billion) in fiscal year 1999-2000. For further information, please visit the NEC home page at http://www.nec-global.com.
About Tensilica
Tensilica was founded in July 1997 to address the fast-growing market for configurable micro-processor cores and software development tools for high volume, embedded systems. Using the company's proprietary Xtensa Processor Generator, system-on-chip (SOC) designers can develop a processor subsystem hardware design and a complete software development tool environment tailored to their specific requirements in hours.
Tensilica's solutions provide a proven, easy-to-use, methodology that enables designers to achieve optimum application performance in minimum design time. The company has over 100 engineers engaged in research, development, and customer support from its offices in Santa Clara, California, Burlington, Massachusetts, Princeton, N. J., Houston, Texas, Oxford, U.K. and Yokohama, Japan.
Tensilica is headquartered in Santa Clara, Calif. (95054) at 3255-6 Scott Boulevard, and can be reached at 408/986-8000 or via www.tensilica.com on the World Wide Web.
Note to Editors: ``Tensilica'' is a registered trademark and ``Xtensa'' is a trademark belonging to Tensilica Inc.
-- Tensilica's announced licensees are, in alphabetical order,
-- Berkeley Wireless Research Center
-- Cisco Systems
-- Fujitsu Limited
-- Galileo Technology
-- NEC Corporation
-- NTT
-- ONEX Communications
-- TranSwitch Corporation
-- ZiLOG
- Visit Tensilica at MST, Booth Number B-22, Tokyo, Japan, November 15 -- 17, 2000.
- Visit Tensilica at Electronica, Hall 5A, Booth Number 175, Munich, Germany, November 20 -- 24, 2000.
Contact:
Tensilica Inc.
Bernie Rosenthal, 408/327-7302
Tensilica K.K., Japan
Masumi Takahashi, 81-45-541-5496
or
Leapfrog Group
Kim Alfaro, 415/563-4769
Related News
- Tensilica Wins Second License Agreement from NEC
- InterDigital and NEC Corporation Extend and Expand Patent License Agreement
- Rambus Signs Patent License Agreement with NEC Electronics
- NEC Electronics and Mysticom Ink Ethernet Core License Agreement
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |