English
Rambus Unveils Next Generation XDR Memory Interface
8GHz XDR2 DRAM with micro-threading enables unprecedented graphics capabilities
RAMBUS DEVELOPER FORUM – TOKYO, Japan - 7/7/2005 Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today announced the latest version of its high-bandwidth XDR memory interface technology, named XDR™2. The XDR2 memory interface uses a micro-threaded DRAM core and circuit enhancements that enable data rates starting at 8GHz, making it five times faster than today’s best-in-class GDDR graphics DRAM products.Building on the high-performance XDR memory interface technology, the XDR2 memory interface is targeting applications that require extreme memory bandwidth, such as 3D graphics, advanced video imaging, and network routing and switching applications. In order to achieve high bandwidth efficiency and data rates of 8GHz and beyond the XDR2 memory interface incorporates:
- Micro-threading – a DRAM core innovation developed to increase memory system efficiency to enable DRAMs to provide more usable data bandwidth to requesting memory controllers, while minimizing power consumption;
- Adaptive Timing – a speed enhancement to today’s XDR FlexPhase™ timing circuits that compensates for process, voltage and temperature variations during real-time operation;
- Transmit Equalization – an output circuit that minimizes the adverse system effects of reflections and attenuation that typically limit the speed of DRAM systems;
- DRSL Signaling – a 200mV differential signaling standard that provides superior common mode noise rejection with an on-chip terminated point-to-point topology that minimizes reflections and reduced signal transition times associated with device loading and PCB trace stubs.
Rambus engineers work closely with chip and system companies to optimize the DRAM controllers to take advantage of the performance benefits that the XDR2 solution provides. The XDR2 memory interface is available for licensing now and could be shipping in products by 2007. Technical specifications are available from Rambus upon request. For additional information, please visit www.rambus.com/xdr/.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus's interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, Calif., with regional offices in Chapel Hill, North Carolina; Bangalore, India; Taipei, Taiwan; and Tokyo, Japan. Additional information is available at www.rambus.com.
Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR and FlexPhase are trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.
|
||||||
Related News
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
|
E-mail This Article | 
|
|
Printer-Friendly Page |