NoC Silicon IP for RISC-V based chips supporting the TileLink protocol
Faraday Announces Ultra-High-Density miniIP Silicon IP Platform for UMC 0.18um Process
HSINCHU, Taiwan and SUNNYVALE, California, – August 2, 2005 -- Faraday Technology Corporation (TAIEX: 3035), a leading ASIC and IP provider, today announced miniIP platform, the first comprehensive 0.18µm IP portfolio designed specifically for cost-sensitive and high time-to-market pressure consumer devices.
With all the hypes, the 0.13µm technology still isn't a viable option to many cost sensitive consumer devices, due to the high mask cost, long turn-around time and high design risks. After comparison, many IC design houses find it makes more sense to improve the efficiency of the matured low-cost 0.18µm process technology for their next generation chips, instead of resorting to 0.13µm technology.
“Faraday's miniIP platform is a complete IP portfolio optimized for chip designers to achieve first silicon cut success, and fast time-to-market,” said Hsin Wang, Associate Vice President of Faraday. “By delivering 25% or more reduction in die size and power dissipation, the miniIP platform promises our customers significant cost advantages and much longer product battery life, two of the most important features consumers care about”
Faraday's miniIP platform includes:
miniLib™ : High-density cell library with 20~30% reduction in core logic area and power consumption when compared with other standard cell libraries; suitable for devices operating at 1.35V ~ 1.98V.
miniIO™ : High-density general purpose I/Os with 40% reduction in the I/O area over the conventional ones.
POC™: Pad-Over-Circuit technology which can reduce 5~10% of overall chip cost by moving the bonding pads above the I/O cells.
miniPLL™ : Essential component PLL completely integrated into the I/O region without taking any core area.
miniROM™ Compiler : High-density diffusion programmable ROM generator which can gain 25% area reduction on the same configuration generated by conventional compilers.
Availability:
The complete set of miniIP portfolio has been silicon proven at UMC 0.18µm process and is available now. For more information, please contact Faraday sales or regional sales reps.
About Faraday Technology Corporation
Faraday Technology Corporation is a leading silicon IP and fabless ASIC vendor. The company's broad IP portfolio includes 32-bit RISC CPUs, DSPs, and PHYs/Controllers for USB 2.0, Ethernet, Serial ATA and PCI Express. With more than 500 employees and 2004 revenue of US$159 million, Faraday is one of the largest fabless ASIC companies in the Asia-Pacific region, and it also has a significant presence in other world-wide markets. Headquartered in Taiwan , Faraday has service and support offices around the world, including the U.S. , Japan , Europe, and China . For more information, please visit: http://www.faraday-tech.com
|
Faraday Technology Corp. Hot IP
Related News
- Impinj Aligns With UMC to Deliver Logic NVM Cores on 0.18um and 0.13um Process Technologies
- SMIC Announces Availability of 0.18um EEPROM Process Technology and EEPROM IP Design Platform
- UMC and Virage Logic Announce Qualification of Embedded Non-Volatile Memory Technology on UMC's 0.18um Logic Process
- UMC First Foundry to Introduce 0.18um 32 Volt High Voltage Process
- Chipidea announces silicon validated analog IP cores in Chartered 0.18um CMOS Process
Breaking News
- HPC customer engages Sondrel for high end chip design
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- TSMC drives A16, 3D process technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
E-mail This Article | Printer-Friendly Page |