CoreSim Delivers ASIC Replacement Based on LatticeEC FPGA
Digital Electronics Design Firm Solves ASIC Conversion Challenge with Low Cost, High Performance Lattice FPGA
HILLSBORO, OR - August 22, 2005 - Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced that advanced design services company CoreSim has selected the LatticeEC™ FPGA to replace an obsolete ASIC for one of its customers. CoreSim has delivered a drop-in component adapter board based on the LatticeEC device to replace the ASIC. The board has a low operating frequency of 60-70 MHz and will be used in an aerospace ground base application. The LatticeEC FPGA is used for phase and bit detection to synchronize incoming signal traffic.
"This project presented some interesting challenges," said Mike Alam, Project Team Leader. "Not only was the ASIC obsolete, it could not be manufactured in any case because most of the original design documentation was lost or unverified. It was a design challenge that required CoreSim's unique design and verification process, but also it clearly called for a low cost programmable logic device. The LatticeEC FPGA offered very attractive features that helped us make our decision. Primary among them was that the Lattice device could be configured using a low cost, standard off the shelf SPI Flash boot PROM. We also were impressed with the part's 5-volt tolerance and signal overshoot/undershoot characteristics. We also liked the density migration available within the LatticeEC family of seven devices.
"The local Lattice support was outstanding," Alam continued. "The Lattice representatives were responsive, knowledgeable and available."
Project Designer Karen Chase used the Lattice ispLEVER® design tools. "I was very pleased with how easy it was to set up the design tools," said Chase.
"It's gratifying to see customers such as CoreSim selecting our LatticeEC and LatticeECP™ low cost, high performance FPGAs," said Stan Kopec, Lattice vice president of corporate marketing. "We were determined to provide customers with FPGAs that were low in cost but high in features and performance, and the enthusiastic reaction to the devices tells us we've achieved that goal," Kopec concluded.
About the LatticeECP-DSP™ and LatticeEC FPGA Families
The LatticeECP-DSP™ and LatticeEC FPGA device families are architected to provide the most optimized feature sets combined with the lowest total solution costs of any FPGAs. The new LatticeECP-DSP products, targeted for high-performance DSP applications, provide up to a 50% performance and 75% logic utilization improvement over other low cost solutions when implementing common DSP functions. The LatticeEC FPGA product family, targeted for general-purpose FPGA applications, is a precise and targeted response to the market's explosive demand for low cost, architecturally streamlined logic solutions. Through advanced 130nm silicon technology, an optimized architecture and proprietary circuit design, the new Lattice devices lower total solution costs by up to 30% to 50% compared with existing FPGA solutions, and are expected to broaden the adoption of FPGAs within the $20 billion ASIC marketplace.
About CoreSim
CoreSim, headquartered in Ottawa, Canada, is a world leader in advanced analysis and design of new circuit boards and design cost reduction of existing products. Companies developing new products partner with CoreSim experts to avoid costly respins and design marginality through concurrent functional and parametric modeling techniques up to Multi GHz frequencies. For existing products, these analysis techniques along with real time system vector capture and hardware modeling create accurate models of hardware / software functional and parametric operating margins. This "digital fingerprint" is the starting point for aggressive design cost reduction. The replacement board model is matched to the original golden model prior to fabrication for first pass success. www.coresim.com
About Lattice Semiconductor
Lattice Semiconductor Corporation provides the industry's broadest range of Field Programmable Gate Arrays ( FPGA) and Programmable Logic Devices ( PLD), including Field Programmable System Chips ( FPSC), Complex Programmable Logic Devices ( CPLD), Programmable Mixed-Signal Products ( ispPAC® ) and Programmable Digital Interconnect Devices ( ispGDX® ). Lattice also offers industry leading SERDES products.
Lattice is "Bringing the Best Together" with comprehensive solutions for system design, including an unequaled portfolio of non-volatile programmable devices that deliver instant-on operation, security and "single chip solution" space savings.
Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in communications, computing, industrial, consumer, automotive, medical and military end markets. Company headquarters are located at 5555 NE Moore Court, Hillsboro, Oregon 97124-6421, USA; telephone 503-268-8000, fax 503-268-8037. For more information about Lattice Semiconductor Corporation, visit http://www.latticesemi.com
Statements in this news release looking forward in time are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements involve risks and uncertainties including market acceptance and demand for our new products, our dependencies on our silicon wafer suppliers, the impact of competitive products and pricing, technological and product development risks and other risk factors detailed in the Company's Securities and Exchange Commission filings. Actual results may differ materially from forward-looking statements.
# # #
Lattice Semiconductor Corporation, Lattice (& design), L (& design), ispGDX, ispLEVER, ispPAC, LatticeEC, LatticeECP, LatticeECP-DSP and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.
GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.
|
Related News
- Corigine Delivers a Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development
- Xilinx Delivers the Industry's First 4M Logic Cell Device, Offering >50M Equivalent ASIC Gates and 4X More Capacity than Competitive Alternatives
- Quartus II Software Version 9.0 Delivers Productivity Leadership for Altera's Portfolio of Transceiver FPGAs and HardCopy ASICs
- Talijon Engineering Chooses LatticeEC FPGA to Replace Obsolete ASIC
- Talijon Engineering delivers turnkey hardware solution using LatticeEC FPGA, Lattice IP Cores and ispPAC Power Manager devices
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |