ESL Design Targets Convergent DSP and FPGA
Joint Offering Combines Celoxica ESL Tools With Advanced DSP+FPGA Systems From Sundance In Complex Signal Processing Implementation
Abingdon, Oxfordshire, UK — September 12, 2005 — Celoxica, the leading provider of C-based electronic system level (ESL) design and synthesis solutions, and Sundance, the leading supplier and manufacturer of advanced digital signal processing (DSP) and reconfigurable FPGA systems, today announced an agreement that bridges the gap between conventional design flows for DSP and FPGA systems. The companies will combine expertise to offer out-of-the-box system design solutions backed up by their established partnerships with Texas Instruments Incorporated and Xilinx Inc.
DSP programming, typically performed by system and software engineers, relies on a software-oriented methodology. FPGA devices are often programmed using design tools evolved from hardware-centric approaches. The different approaches and levels of abstraction make it difficult to combine the two technologies. The joint offering from Celoxica and Sundance uses C-based ESL tools to enable system optimizations employing a comprehensive array of off-the-shelf modules and systems to address the critical issues of hardware/software co-design, DSP/FPGA integration, power utilization and cost reductions from design conception through to deployment.
“System designers commonly choose between DSP for signal processing systems and FPGAs to implement complex algorithms and signal processing systems,” said Phil Bishop, president and CEO of Celoxica. “Combined they can offer a compelling solution for optimization of power, performance and flexibility. The key to unlocking this potential is providing design ease-of-use from both the DSP and FPGA perspectives.”
“Many of our customers have already moved to model-based design and IP reuse to help streamline design and boost productivity,” said Flemming Christensen, managing director of Sundance. “With more and more effort now being placed on value-added IP and customization inside a mixed DSP/ FPGA system, the addition of C-based design that tackles complex algorithm development in hardware and software is inevitable."
The result of this partnership is the development of algorithm acceleration solutions for vertical applications, including C-based IP modules, optimized FPGA hardware accelerators, and reference board prototypes built on Sundance boards programmed using Celoxica software tools. The companies will initially focus their efforts on software-defined radio (SDR) and complex image processing, and will begin rolling out solutions in Q4/05 at the Global Signal Processing Expo (GSPx), Santa Clara.
‘With this improved design flow for DSP plus FPGA based systems, customers can more easily integrate the performance of TI DSP with FPGA based co-processors,” said Ram Sathappan, SDR business development manager, Texas Instruments. “C-based design and synthesis for hardware and software in DSP/ FPGA based COTS systems will address the needs of a wide range of designers.”
“Xilinx and our Alliance Program members are seeing increasing market acceptance of our FPGAs for a broad range of DSP applications. We are gratified that Celoxica and Sundance have combined their expertise to make DSP development more accessible to design engineers to further accelerate this growth,” said Robert Bielby, Xilinx senior director for vertical markets and partnerships.
About Celoxica
An innovator in Electronic System Level (ESL) design, Celoxica is turning software into silicon by supplying the design tools, boards, IP and services that enable the next generation of advanced electronic product design. Celoxica technology raises design abstraction to the algorithm level, accelerating productivity and lowering risk and costs by generating semiconductor hardware directly from C-based software descriptions. Adding to a growing installed base, Celoxica provides the world’s most widely used C-based behavioral design and synthesis solutions to companies developing semiconductor products in markets such as consumer electronics, defense and aerospace, automotive, industrial and security. For more information, visit: www.celoxica.com.
About Sundance
Sundance designs, develops, manufactures and markets high performance signal processing and reconfigurable systems for original equipment manufacturers in the wireless and signal processing markets. Leveraging its multiprocessor expertise and experience, Sundance provides OEM with modular DSP and FPGA-based systems as well as data acquisition, I/O, communication and interconnectivity products that are essential to multiprocessor systems where scalability and performance are essential. With over fifty different modules and carriers for PCI, cPCI VME and Stand Alone platforms, Sundance is a solution provider to semiconductor, pharmaceutical and factory automation industries. Sundance, founded in 1989 by the current directors, is a member of the TI Third Party Network, Xilinx Xperts and MathWorks’ Connection programs.
###
Celoxica and the Celoxica logo are trademarks of Celoxica, Ltd. All other brand names and product names are the property of their respective owners
|
Related News
- Xilinx Targets $2 Billion High-Performance DSP Market With FPGA Industry's First Application-Optimized Solution Roadmaps
- New Agreement Bridges the Gap Between Conventional Design Flows for DSP and FPGA Systems using ESL Tools
- Credo Targets Hyperscale Data Centers and 5G Networks with New Optical DSPs
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
- Aldec's New HES FPGA Accelerator Board Targets HPC, HFT and Prototyping Applications plus Hits the "Price/Performance" Sweet Spot
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |