White Electronic Designs Awarded $1.9 Million Contract for System-On-Chip Microprocessor Modules for Air-to-Air Missiles
PHOENIX -- Sept. 20, 2005 -- White Electronic Designs Corporation (Nasdaq: WEDC) has been awarded a $1.9 million contract by a leading military subcontractor. The award is for System-On-Chip (SOC) Power PC products, which will be used in the latest generation of air-to-air missiles.
White Electronic Designs Corporation Chairman and CEO Hamid Shokrgozar noted, "We are pleased to receive this production order in support of a combat proven air-to-air missile. Multichip packages or SOCs are viewed as part of the solution for the widening gap between silicon I/O density and the material capabilities of the package and board/substrate. The system designer can customize performance using the most cost-effective silicon solutions from different fabrications all in the same package."
Mr. Shokrgozar continued, "Our dedication to research and development for our military customers continues to be validated by being chosen to provide this type of leading-edge technology. We are proud to provide these mission-critical components that contribute to making our military forces the most sophisticated in the world."
The Company expects to ship these products over the next 24 months.
About White Electronic Designs Corporation
White Electronic Designs Corporation designs, develops and manufactures innovative components and systems for high technology sectors in military, industrial, medical and commercial markets. White's products include advanced semiconductor packaging of high-density memory products and state-of-the-art microelectronic multi-chip modules for military and defense industries and data and telecommunications markets; anti-tamper products for mission-critical semiconductor components in defense and secure commercial applications; enhanced and ruggedized high-legibility flat-panel displays for commercial, medical, defense and aerospace systems; digital keyboard, touch-screen operator-interface systems, RFID antenna and medical sensors; and electromechanical assemblies for OEM's in commercial and military markets. White is headquartered in Phoenix, Arizona, and has design and manufacturing centers in Arizona, Indiana, Ohio and Oregon. To learn more about White Electronic Designs Corporation's business, as well as employment opportunities, visit our website, http://www.wedc.com.
|
Related News
- DAFCA Receives $1.8 Million ATP Grant to Develop Reconfigurable Infrastructure Platform for System-on-Chip Electronics
- Virage Logic Reports Record Revenues for Third-Quarter Fiscal 2004; Posts 45% Year-Over-Year Revenue Growth; Record Royalties of $1.9 Million
- Sun Microsystems Awarded $44 Million Department of Defense Contract to Develop Microchip Interconnect System
- Ridgetop Group Awarded $1 Million Contract from NAVAIR
- QuickLogic Awarded New $3.0 Million eFPGA Contract
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |