ICE-IP-338 High-speed XTS-GCM Multi Stream Inline Cipher Engine
Rambus Signs Patent License Agreement With Renesas Technology Corp.
Five-year agreement covers memory and logic interfaces
LOS ALTOS, California, United States - 9/29/2005 Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today announced it has signed a patent license agreement with Renesas Technology Corp. that allows the development and manufacture of integrated circuits (ICs) employing interfaces based on Rambus’ patented inventions.
The agreement is for a five-year term and covers high-speed controllers and other interfaces invented by Rambus. Under the agreement, Renesas will provide monetary and other compensation to Rambus. Specific terms of the agreement are confidential.
“Renesas is a global leader in the semiconductor market and signing this renewal represents strong validation of our patent portfolio,” said Harold Hughes, chief executive officer at Rambus. “This agreement continues our relationship with an industry leader and expands the availability of our technology in the market.”
Since its founding in 1990, Rambus has focused on advancing electronic system performance through innovations in logic and memory interfaces, controller architectures, and system design. The result is a broad portfolio of innovations and patents that enables semiconductor manufacturers and system designers to achieve ever-increasing levels of functionality and performance, to lower system costs, to mitigate risk with silicon-proven designs, and to reduce time to market. For more information on Rambus’ patent portfolio, please visit www.rambus.com/products/innovationslicensing/.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company's innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus's interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, California, with regional offices in Chapel Hill, North Carolina; Bangalore, India; Taipei, Taiwan; and Tokyo, Japan. Additional information is available at www.rambus.com.
|
Related News
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |