Advanced `All-In-One' Modem Chip From TDK Semiconductor Supports Caller ID, Blacklisting, Parallel Phone Detect

TUSTIN, Calif.--(BUSINESS WIRE)--Jan. 7, 2002--TDK Semiconductor Corp., a leader in the design and manufacture of communications semiconductors for worldwide markets, has expanded significantly on its "all-in-one" 73M2901 introduced in 1999 with the release of the new 73M2901CL, a 3.3V single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem.

The 73M2901CL feature-rich set includes critical functions like Caller ID, blacklisting, parallel phone detect (Line-In-Use and Parallel-Pick-Up/Line-Seize), long space disconnect, inactivity timeout and programmable call progress.

The 73M2901CL high performance, low power modem IC has integrated a great portion of the modem circuit on the chip, such as the microprocessor, DSP, analog front end, and hybrid driver. The 3.3V single chip architecture makes it physically small enough for the modular form factor, and virtually eliminates the need to specify hard-to-source passive components specific to other modem vendors. The device truly is a "one chip fits all" implementation for applications including set-top boxes, point-of-sale terminals, automatic teller machines, hand-held communication devices, metering devices, vending machines and smart card readers.

Andy Mills, senior vice president for the company's Broadband Communications Products, said: "The 73M2901CL offers the highest level of integration available today. It lends itself to embedded applications by handling all of the data formatting, data pump control, call progress negotiation and call monitoring.

"It offers a very simple serial interface, V.24, to the host over which commands and data packets are sent. The command style is an incredibly simple AT command set with enough user control to allow the embedded designer to customize the 73M2901CL for any application and any country in the world."

The new 73M2901CL is based on TDK Semiconductor's implementation of the industry standard 8032 microcontroller core with a proprietary multiply and accumulate (MAC) coprocessor, analog front end, Sigma Delta A/D and D/A. The ROM and RAM necessary to operate the modem are contained on the device. Additionally, the 73M2901CL provides an on-chip oscillator and hybrid driver.

The 73M2901CL high performance, low power modem IC is capable of data transmission and reception through 2400bps. Consuming as little as 9.5mA, the 73M2901CL is intended for embedded applications and battery operation. This device offers options for modem design from 2.7v to 3.6v with optional internal hybrid and country specific call progress support.

TDK Semiconductor recently completed an instructional training CD ROM module demonstrating how the 73M2901CL, when used in conjunction with the company's protocol software, provides MNP/V.42/V.42bis data correction and compression protocols within a host platform. The self-paced multimedia CD ROM walks users through the general architecture, system requirements, software interfaces, and system integration methodology used to perform a successful integration of the software into a host-based system design. The protocol firmware integration CD ROM presentation is available upon written request.

The 73M2901CL single chip modem is available in a 32-pin PLCC, 32-pin TQFP or a 44-pin LQFP package. The devices are priced at $6.49 each in 10,000 unit quantities. Samples are currently available. Additional product information and the name of your closest representative can be obtained by visiting the company's Web site at http://www.tdksemiconductor.com, sending an e-mail to support@tdksemiconductor.com or by calling 714/508-8800.

TDK Semiconductor, part of the $5.6 billion TDK Corp. (NYSE:TDK - news), is a leader in advanced technology IC solutions for communications markets. The company designs and manufactures semiconductor solutions for local- and wide-area networking, embedded modem subsystems, set-top boxes and digital TV applications. Its products are used globally for connectivity and data acquisition.