SMIC and CYIT Successfully Manufacture 0.13um 3G Handset Chips
"To successfully manufacture the 3G handset chips using SMIC's 0.13um technology in such a short period of time demonstrates SMIC's technological prowess. We look forward to further collaboration with SMIC in the volume production of these chips," said Jianhong Zheng, Vice-President of CYIT.
"It is an honor for SMIC to partner with a leading 3G TD-SCDMA handset company like CYIT. The combination of CYIT's 3G handset expertise and SMIC's advanced 0.13um process technology enables domestic 3G handsets to take another step toward commercialization and full-flow domestic production," said Ning Hsieh, Vice-President of Marketing & Sales at SMIC.
Improving upon previous generations of handset technology whose functions were limited by low bandwidths, 3G handsets use broadband that accommodates web-based applications such as video conferencing, digital photography and video, and internet access. The success of CYIT's chips using SMIC's wafer manufacturing represents an important advance in China's 3G handset technology.
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 0.11-micron and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In the first quarter of 2005, SMIC commenced commercial production at its 12-inch wafer fabrication facility in Beijing. SMIC also maintains customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. As part of its dedication towards providing high-quality services, SMIC has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000, BS7799 and ISO14001 certifications. For additional information, please visit http://www.smics.com.
|
SMIC Hot IP
Related News
- Faraday Successfully Completes a Range of 0.13um ASIC Productions
- Tower Semiconductor Wins High-Volume Manufacturing Deal for Fab2 at the 0.13um Technology Generation
- Faraday Implements Ultra Small ARM926EJ-S Hard Core in UMC 0.13um Process
- Cosmic Circuits introduces industry's lowest power 10-bit 1MSPS ADC IP-block in 0.13um process
- Chipidea extends its IP Portfolio for Video applications with a new very compact 210MHz Analog Front-End (AFE) in 0.13um CMOS technology
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |