Intersil files SOI suit against Soitec
EE Times
(11/02/2005 4:40 PM EST)
SAN JOSE, Calif. — Intersil Corp. has filed a suit against France’s Soitec S.A. over alleged infringement of silicon-on-insulator (SOI) patents.
The suit, filed in the U.S. District Court for the Eastern District of Texas on Oct. 27, alleges that Soitec is infringing upon Intersil’s patent using “a rapid thermal process for manufacturing a wafer bonded silicon-on-insulator semiconductor,” according to court documents. The patent involved is U.S. Patent No. 4,771,016.
E-mail This Article | Printer-Friendly Page |
Related News
- MEMC Conducts Seizure and Files Suit Against Soitec for Patent Infringement
- Mentor Graphics Files Patent Infringement Suit against EVE
- WiLAN Files Patent Infringement Suit
- NVE Files Patent Infringement Suit Against Everspin Technologies
- MOSAID Files Patent Infringement Suit Against NVIDIA, Freescale and Interphase
Breaking News
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition