Impinj and Texas Instruments Announce RFID Gen 2 Supply Agreement
Impinj’s Silicon Chips Enable TI’s Ultra-high Frequency (UHF) EPC Gen 2 Products
SEATTLE, Wash., November 29, 2005 -- Impinj, Inc., the fabless semiconductor company whose patented Self-Adaptive Silicon® technology enables its two business lines: semiconductor intellectual property and high performance radio frequency identification (RFID) products, and Texas Instruments Incorporated (TI) (NYSE: TXN), a leading provider of RFID chips, inlays and straps, today announced a supply agreement under which Impinj will provide its Monza™ RFID Generation 2 (Gen 2) chips for inclusion in TI’s initial production of RFID inlay and strap products.
As part of its Gen 2 product offering, TI is using Monza chips from Impinj for its manufacturing of Gen 2 inlays and straps that label converter companies are incorporating into finished RFID tags for use by consumer goods manufacturers in the global retail supply chain. Part of Impinj’s GrandPrix solution for robust RFID systems, Monza is the world’s first tag chip certified as compliant with the Gen 2 standard promulgated by EPCglobal Inc™, the industry consortium established to promote RFID in the global supply chain.
“We are very pleased that our cooperation with TI has resulted in this supply agreement,” said Dr. William Colleran, president and CEO, Impinj. “With this announcement, we add to the already impressive list of strap and inlay customers who have selected Impinj’s Monza chips as their choice for high volume Gen 2 solutions.”
“This agreement with Impinj, in combination with TI’s development of Gen 2 inlay and strap products, has accelerated our global retail supply chain customers’ transition to this new standard,” said Tony Sabetti, UHF/Retail Supply Chain director, Texas Instruments RFid Systems.
Impinj’s Monza Gen 2 chips provide all of the benefits promised by the Gen 2 protocol, including improved tag readability and throughput, compliance with global spectral regulations, 96-bit EPC identification codes and enhanced security, privacy and robustness. Compared to legacy Gen 1 chips, Monza chips feature superior read and write range, high-speed field rewritability and orientation insensitivity when used in a dual antenna configuration. In keeping with Impinj’s high quality standards, Monza chips are 100% factory tested and exhibit excellent RF impedance and ESD insensitivity, characteristics for ensuring superior inlay manufacturability in accordance with TI’s rigorous standards for quality and performance.
About Impinj, Inc.
Impinj, Inc. is a fabless semiconductor company whose patented Self-Adaptive Silicon® technology enables its two synergistic business lines: high performance RFID products and cost-effective semiconductor intellectual property (SIP). A leading contributor to the RFID standards for high volume supply-chain applications worldwide, Impinj leverages its technical expertise and industry partnerships to deliver the GrandPrix™ solution, comprising tags, readers, software and systems integration to offer RFID that just works™. Impinj’s innovative SIP products, core to the company’s RFID tags, are licensed to leading semiconductor companies worldwide, allowing them to cost-effectively integrate crucial nonvolatile memory (NVM) alongside analog and digital functionality on a single chip. Impinj's SIP products include the popular AEON™ memory, the world's first rewriteable NVM technology compatible with logic CMOS manufacturing, and AEFuse™, the world's first rewriteable fuse architecture. For more information, visit www.impinj.com.
About Texas Instruments
Texas Instruments is the world’s largest integrated manufacturer of radio frequency identification (RFID) transponders and reader systems. Capitalizing on its competencies in high-volume semiconductor manufacturing and microelectronics packaging, TI is a visionary leader and at the forefront of establishing new markets and international standards for RFID applications. For more information, visit the Web site at www.ti-rfid.com.
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers’ real world signal processing requirements. In addition to Semiconductor, the company’s businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas and has manufacturing, design or sales operations in more than 25 countries. Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com.
|
Related News
- Impinj and RF IDentics Announce 25 Million UHF Gen 2 RFID Supply Agreement
- Impinj's Gen 2 RFID Monza Tag Chips and Speedway Readers Earn EPCglobal Interoperability Certification
- Impinj Unveils Gen 2 RFID Tag Chips with Specialized Data Storage for Enhanced Article Identification and Anti-counterfeiting
- Impinj, NEC TOKIN and NEC Partner to Deliver High Performance Gen 2 RFID Readers in Japan
- Impinj Extends GrandPrix Gen 2 RFID Solution to Item-Level Tagging
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |