English
Adaptive Clock Generation Module for DVFS and Droop Response
SMIC starts volume production of 0.18 um Color-VGA CMOS Image Sensor (CIS) wafers
SHANGHAI, CHINA – December 7, 2005 -- In a strategic move to continue to expand its Silicon foundry business into the booming CMOS image sensor (CIS) market, Semiconductor Manufacturing International Corporation (NYSE:SMI) today announced volume production and shipment of 0.18um color-VGA resolution CMOS image sensor wafers to a fabless customer based on SMIC’s proprietary 0.18um CMOS image process and Toppan’s color filter/microlens technology.
“Our 0.18um CMOS image process technology will enable us to further serve the growing electronics consumer market in China and around the world, especially the segments of cell phone cameras, home-security and automobile applications,” said Mr. Roger Lee, Senior Vice President of SMIC. “Thanks to our CMOS image sensor process development team’s dedication and hard work, we believe we have become a leader in CMOS sensor production here in China.”
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 90-nanometer and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In the first quarter of 2005, SMIC commenced commercial production at its 12-inch wafer fabrication facility in Beijing. SMIC also maintains customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. As part of its dedication towards providing high-quality services, SMIC has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000, BS7799 and ISO14001 certifications. For additional information, please visit http://www.smics.com.
“Our 0.18um CMOS image process technology will enable us to further serve the growing electronics consumer market in China and around the world, especially the segments of cell phone cameras, home-security and automobile applications,” said Mr. Roger Lee, Senior Vice President of SMIC. “Thanks to our CMOS image sensor process development team’s dedication and hard work, we believe we have become a leader in CMOS sensor production here in China.”
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 90-nanometer and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In the first quarter of 2005, SMIC commenced commercial production at its 12-inch wafer fabrication facility in Beijing. SMIC also maintains customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. As part of its dedication towards providing high-quality services, SMIC has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000, BS7799 and ISO14001 certifications. For additional information, please visit http://www.smics.com.
|
||||||
SMIC Hot IP
Related News
- SNOWBUSH microelectronics Announces 10-Bit, 140 MSPS, ADC IP Core in Foundry Standard 0.18 um CMOS Process
- SMIC Successfully Developed 0.11 Micron CIS Process Technology
- eMemory Collaborates with MagnaChip to Offer One Time Programmable Macro for 0.18 um CMOS Process
- Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform
- Tower Semiconductor Begins Volume Production of ViTi's CMOS Image Sensors for Home Security and Surveillance Systems
Breaking News
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
- intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
- TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
- Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
Most Popular
- Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+
- 创飞芯宣布其反熔丝一次性可编程（OTP）技术在90nm BCD 工艺上实现量产
- Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Mixel Announces the Opening of New Branch in Da Nang, Vietnam
|
E-mail This Article | 
|
|
Printer-Friendly Page |